NTMS4107N
Power MOSFET
30 V, 18 A, Single N−Channel, SO−8
Features
• Ultra Low R
(at 4.5 V ), Low Gate Resistance and Low Q
GS G
DS(on)
• Optimized for Low Side Synchronous Applications
• High Speed Switching Capability
http://onsemi.com
Applications
V
R
TYP
I MAX
D
(BR)DSS
DS(on)
• Notebook Computer Vcore Applications
• Network Applications
• DC−DC Converters
3.4 mW @ 10 V
4.7 mW @ 4.5 V
30 V
18 A
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Drain−to−Source Voltage
Symbol Value Unit
V
30
$20
15
V
V
A
DSS
Gate−to−Source Voltage
V
GS
G
Continuous Drain
Current (Note 1)
T = 25°C
I
D
A
Steady
State
T = 85°C
A
11
S
t v10 s T = 25°C
18
A
Power Dissipation
(Note 1)
Steady
State
P
1.67
W
D
MARKING DIAGRAM/
PIN ASSIGNMENT
T = 25°C
A
t v10 s
2.5
11
Continuous Drain
Current (Note 2)
T = 25°C
A
I
D
A
1
8
8
Source
Source
Source
Gate
Drain
Drain
Drain
Drain
Steady
State
T = 85°C
A
8.0
0.93
1
Power Dissipation
(Note 2)
P
D
W
T = 25°C
A
SO−8
CASE 751
STYLE 12
Pulsed Drain Current
t = 10 ms
I
56
A
(Top View)
p
DM
Operating Junction and Storage Temperature
T , T
J
−55 to
150
°C
stg
Continuous Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
I
3.0
A
4107N = Specific Device Code
S
A
L
= Assembly Location
= Wafer Lot
E
AS
880
mJ
Energy (V = 30 V, V = 10 V, I = 42 A,
DD
GS
PK
Y
W
= Year
= Work Week
L = 1 mH, R = 25 W)
G
Lead Temperature for Soldering Purposes
T
L
260
°C
(1/8″ from case for 10 s)
ORDERING INFORMATION
THERMAL RESISTANCE RATINGS
Rating
Symbol
Max
75
Unit
Device
NTMS4107NR2
Package
Shipping†
Junction−to−Ambient − Steady State (Note 1)
Junction−to−Ambient − t v 10 s (Note 1)
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
q
q
JA
JA
JA
SO−8
2500/Tape & Reel
R
R
50
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
135
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface−mounted on FR4 board using 1″ sq. pad size
(Cu area = 1.127″ sq. [1 oz] including traces).
2. Surface−mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412″ sq.).
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
March, 2005 − Rev. 1
NTMS4107N/D