NTMS4706N
Power MOSFET
30 V, 10.3 A, Single N−Channel, SO−8
Features
• Low R
DS(on)
• Low Gate Charge
• Standard SO−8 Single Package
• Pb−Free Package is Available
http://onsemi.com
V
R
DS(ON)
TYP
I MAX
D
(Note 1)
(BR)DSS
Applications
• Notebooks, Graphics Cards
• Synchronous Rectification
• High Side Switch
9.0 mW @ 10 V
30 V
10.3 A
11.4 mW @ 4.5 V
• DC−DC Converters
N−Channel
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
D
Parameter
Drain−to−Source Voltage
Symbol Value Unit
V
30
20
V
V
A
DSS
Gate−to−Source Voltage
V
GS
Continuous Drain
Current (Note 1)
Steady
State
I
D
T = 25°C
8.6
6.2
A
G
T = 85°C
A
t v 10 s T = 25°C
10.3
1.5
A
S
Power Dissipation
(Note 1)
T = 25°C
A
P
W
Steady
State
D
D
MARKING DIAGRAM/
PIN ASSIGNMENT
t v 10 s
2.2
6.4
Continuous Drain
Current (Note 2)
Steady
State
I
A
T = 25°C
D
A
T = 85°C
A
4.6
1
8
Source
Source
Source
Gate
Drain
Drain
Drain
Drain
Power Dissipation
(Note 2)
T = 25°C
A
P
0.83
W
1
Pulsed Drain Current
t = 10 ms
p
I
31
A
DM
SO−8
CASE 751
STYLE 12
Operating Junction and Storage Temperature
T ,
T
stg
−55 to
150
°C
Top View
J
Source Current (Body Diode)
I
2.1
A
S
4706N = Device Code
Single Pulse Drain−to−Source Avalanche Energy
E
150
mJ
AS
A
= Assembly Location
(V = 25 V, V = 10 V, I Peak = 7.5 A,
DD
GS
L
L
= WaferLot
L = 10 mH, R = 25 W)
G
Y
= Year
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
WW
G
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
L
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
ORDERING INFORMATION
°C/W
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – t v 10 s (Note 1)
Junction−to−Ambient – Steady State (Note 2)
R
q
JA
R
q
JA
R
q
JA
83.5
58
†
Device
Package
Shipping
NTMS4706NR2
NTMS4706NR2G
SO−8
2500/Tape & Reel
2500/Tape & Reel
150
SO−8
(Pb−Free)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surfacemounted on FR4 board using the minimum recommended pad size.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
November, 2005 − Rev. 3
NTMS4706N/D