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NTMS4706N PDF预览

NTMS4706N

更新时间: 2024-09-15 06:00:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 68K
描述
Power MOSFET 30 V, 10.3 A, Single N−Channel, SO−8

NTMS4706N 数据手册

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NTMS4706N  
Power MOSFET  
30 V, 10.3 A, Single N−Channel, SO−8  
Features  
Low R  
DS(on)  
Low Gate Charge  
Standard SO−8 Single Package  
Pb−Free Package is Available  
http://onsemi.com  
V
R
DS(ON)  
TYP  
I MAX  
D
(Note 1)  
(BR)DSS  
Applications  
Notebooks, Graphics Cards  
Synchronous Rectification  
High Side Switch  
9.0 mW @ 10 V  
30 V  
10.3 A  
11.4 mW @ 4.5 V  
DC−DC Converters  
N−Channel  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
D
Parameter  
Drain−to−Source Voltage  
Symbol Value Unit  
V
30  
20  
V
V
A
DSS  
Gate−to−Source Voltage  
V
GS  
Continuous Drain  
Current (Note 1)  
Steady  
State  
I
D
T = 25°C  
8.6  
6.2  
A
G
T = 85°C  
A
t v 10 s T = 25°C  
10.3  
1.5  
A
S
Power Dissipation  
(Note 1)  
T = 25°C  
A
P
W
Steady  
State  
D
D
MARKING DIAGRAM/  
PIN ASSIGNMENT  
t v 10 s  
2.2  
6.4  
Continuous Drain  
Current (Note 2)  
Steady  
State  
I
A
T = 25°C  
D
A
T = 85°C  
A
4.6  
1
8
Source  
Source  
Source  
Gate  
Drain  
Drain  
Drain  
Drain  
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
0.83  
W
1
Pulsed Drain Current  
t = 10 ms  
p
I
31  
A
DM  
SO−8  
CASE 751  
STYLE 12  
Operating Junction and Storage Temperature  
T ,  
T
stg  
−55 to  
150  
°C  
Top View  
J
Source Current (Body Diode)  
I
2.1  
A
S
4706N = Device Code  
Single Pulse Drain−to−Source Avalanche Energy  
E
150  
mJ  
AS  
A
= Assembly Location  
(V = 25 V, V = 10 V, I Peak = 7.5 A,  
DD  
GS  
L
L
= WaferLot  
L = 10 mH, R = 25 W)  
G
Y
= Year  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
WW  
G
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
L
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol Value Unit  
ORDERING INFORMATION  
°C/W  
Junction−to−Ambient – Steady State (Note 1)  
Junction−to−Ambient – t v 10 s (Note 1)  
Junction−to−Ambient – Steady State (Note 2)  
R
q
JA  
R
q
JA  
R
q
JA  
83.5  
58  
Device  
Package  
Shipping  
NTMS4706NR2  
NTMS4706NR2G  
SO−8  
2500/Tape & Reel  
2500/Tape & Reel  
150  
SO−8  
(Pb−Free)  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq  
[1 oz] including traces).  
2. Surfacemounted on FR4 board using the minimum recommended pad size.  
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting  
Techniques Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
November, 2005 − Rev. 3  
NTMS4706N/D  
 

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