NTMS4176P
Power MOSFET
-30 V, -9.6 A, P-Channel, SOIC-8
Features
•ꢀLow R
) to Minimize Conduction Losses
DS(on
•ꢀLow Capacitance to Minimize Driver Losses
•ꢀOptimized Gate Charge to Minimize Switching Losses
•ꢀSOIC-8 Surface Mount Package Saves Board Space
•ꢀThis is a Pb-Free Device
http://onsemi.com
V
R
Max
DS(on)
I
Max
(BR)DSS
D
18 mW @ -10 V
30 mW @ -4.5 V
-30 V
-9.6 A
Applications
•ꢀLoad Switches
•ꢀNotebook PC's
•ꢀDesktop PC's
P-Channel
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Rating
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Symbol
Value
-30
Unit
V
V
DSS
G
V
GS
25
V
I
D
A
T = 25°C
-7.3
-5.8
1.44
A
Current R
(Note 1)
q
JA
T = 70°C
A
S
Power Dissipation
(Note 1)
T = 25°C
A
P
D
W
A
R
q
JA
MARKING DIAGRAM
& PIN ASSIGNMENT
Continuous Drain
Current R (Note 2)
I
D
T = 25°C
A
-5.5
-4.4
0.81
q
JA
T = 70°C
A
Steady
State
D
D D D
Power Dissipation
(Note 2)
T = 25°C
A
P
I
W
A
8
D
R
q
JA
4176P
AYWW
G
SOIC-8
CASE 751
STYLE 12
8
Continuous Drain
Current R
(Note 1)
T = 25°C
A
-9.6
-7.7
2.5
D
t < 10 s
q
JA
1
T = 70°C
A
1
S
S S G
Power Dissipation
t < 10 s (Note 1)
T = 25°C
A
P
D
W
A
R
q
JA
4176P = Device Code
A
= Assembly Location
= Year
= Work Week
Pulsed Drain Current
T = 25°C,
A
t = 10 ms
I
-39
DM
Y
p
WW
G
Operating Junction and Storage Temperature
Source Current (Body Diode)
T , T
J
-55 to
+150
°C
STG
= Pb-Free Package
I
S
-2.1
A
ORDERING INFORMATION
Single Pulse Drain-to-Source Avalanche
Energy T = 25°C, V = 30 V, V = 10 V,
EAS
112.5
mJ
J
DD
I = 15 A , L = 1.0 mH, R = 25 W
GS
†
Device
NTMS4176PR2G
Package
Shipping
2500/Tape & Reel
L
pk
G
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
SOIC-8
(Pb-Free)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 inch sq pad size, 1 oz Cu.
2. Surface-mounted on FR4 board using the minimum recommended pad size.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©ꢀ Semiconductor Components Industries, LLC, 2008
March, 2008 - Rev. 0
1
Publication Order Number:
NTMS4176P/D