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NTMS4176PR2G PDF预览

NTMS4176PR2G

更新时间: 2024-11-09 10:30:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 87K
描述
Power MOSFET -30 V, -9.6 A, P-Channel, SOIC-8

NTMS4176PR2G 数据手册

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NTMS4176P  
Power MOSFET  
-30 V, -9.6 A, P-Channel, SOIC-8  
Features  
ꢀLow R  
) to Minimize Conduction Losses  
DS(on  
ꢀLow Capacitance to Minimize Driver Losses  
ꢀOptimized Gate Charge to Minimize Switching Losses  
ꢀSOIC-8 Surface Mount Package Saves Board Space  
ꢀThis is a Pb-Free Device  
http://onsemi.com  
V
R
Max  
DS(on)  
I
Max  
(BR)DSS  
D
18 mW @ -10 V  
30 mW @ -4.5 V  
-30 V  
-9.6 A  
Applications  
ꢀLoad Switches  
ꢀNotebook PC's  
ꢀDesktop PC's  
P-Channel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Rating  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
Continuous Drain  
Symbol  
Value  
-30  
Unit  
V
V
DSS  
G
V
GS  
25  
V
I
D
A
T = 25°C  
-7.3  
-5.8  
1.44  
A
Current R  
(Note 1)  
q
JA  
T = 70°C  
A
S
Power Dissipation  
(Note 1)  
T = 25°C  
A
P
D
W
A
R
q
JA  
MARKING DIAGRAM  
& PIN ASSIGNMENT  
Continuous Drain  
Current R (Note 2)  
I
D
T = 25°C  
A
-5.5  
-4.4  
0.81  
q
JA  
T = 70°C  
A
Steady  
State  
D
D D D  
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
I
W
A
8
D
R
q
JA  
4176P  
AYWW  
G
SOIC-8  
CASE 751  
STYLE 12  
8
Continuous Drain  
Current R  
(Note 1)  
T = 25°C  
A
-9.6  
-7.7  
2.5  
D
t < 10 s  
q
JA  
1
T = 70°C  
A
1
S
S S G  
Power Dissipation  
t < 10 s (Note 1)  
T = 25°C  
A
P
D
W
A
R
q
JA  
4176P = Device Code  
A
= Assembly Location  
= Year  
= Work Week  
Pulsed Drain Current  
T = 25°C,  
A
t = 10 ms  
I
-39  
DM  
Y
p
WW  
G
Operating Junction and Storage Temperature  
Source Current (Body Diode)  
T , T  
J
-55 to  
+150  
°C  
STG  
= Pb-Free Package  
I
S
-2.1  
A
ORDERING INFORMATION  
Single Pulse Drain-to-Source Avalanche  
Energy T = 25°C, V = 30 V, V = 10 V,  
EAS  
112.5  
mJ  
J
DD  
I = 15 A , L = 1.0 mH, R = 25 W  
GS  
Device  
NTMS4176PR2G  
Package  
Shipping  
2500/Tape & Reel  
L
pk  
G
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
SOIC-8  
(Pb-Free)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface-mounted on FR4 board using 1 inch sq pad size, 1 oz Cu.  
2. Surface-mounted on FR4 board using the minimum recommended pad size.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
©ꢀ Semiconductor Components Industries, LLC, 2008  
March, 2008 - Rev. 0  
1
Publication Order Number:  
NTMS4176P/D  
 

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