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NTMS4802N PDF预览

NTMS4802N

更新时间: 2024-09-15 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 112K
描述
Power MOSFET 30 V, 18 A, N−Channel, SO−8

NTMS4802N 数据手册

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NTMS4802N  
Power MOSFET  
30 V, 18 A, NChannel, SO8  
Features  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
This is a PbFree Device  
http://onsemi.com  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
Applications  
4.0 mW @ 10 V  
5.5 mW @ 4.5 V  
30 V  
18 A  
DCDC Converters  
Synchronous MOSFET  
Printers  
NChannel  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
D
Parameter  
DraintoSource Voltage  
Symbol Value Unit  
V
30  
20  
V
V
A
DSS  
GatetoSource Voltage  
V
GS  
G
Continuous Drain  
I
D
T = 25°C  
15  
A
Current R  
(Note 1)  
q
JA  
T = 70°C  
A
12  
S
Power Dissipation R  
(Note 1)  
T = 25°C  
P
1.66  
W
A
q
A
D
JA  
JA  
MARKING DIAGRAM/  
PIN ASSIGNMENT  
Continuous Drain  
I
D
T = 25°C  
A
11.1  
8.9  
Current R  
(Note 2)  
q
JA  
T = 70°C  
A
Steady  
State  
1
8
Source  
Source  
Source  
Gate  
Drain  
Drain  
Drain  
Drain  
Power Dissipation R  
(Note 2)  
T = 25°C  
A
P
I
0.91  
W
A
1
q
D
SO8  
CASE 751  
STYLE 12  
Continuous Drain  
T = 25°C  
A
18  
15  
D
Current R , t v 10 s  
q
JA  
T = 70°C  
A
(Note 1)  
Top View  
Power Dissipation  
T = 25°C  
A
P
D
2.5  
W
4802N = Device Code  
R
, t v 10 s(Note 1)  
q
JA  
A
= Assembly Location  
Y
= Year  
= Work Week  
= PbFree Package  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
60  
A
A
p
WW  
G
Operating Junction and Storage Temperature  
T ,  
55 to  
150  
°C  
J
stg  
T
(Note: Microdot may be in either location)  
Source Current (Body Diode)  
I
S
2.5  
A
Single Pulse DraintoSource Avalanche Energy  
E
420  
mJ  
AS  
ORDERING INFORMATION  
(T = 25°C, V = 30 V, V = 10 V,  
J
DD  
GS  
I = 29 A , L = 1.0 mH, R = 25 W)  
Device  
Package  
Shipping  
2500/Tape & Reel  
L
pk  
G
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
NTMS4802NR2G  
SO8  
(PbFree)  
THERMAL RESISTANCE MAXIMUM RATINGS  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Parameter  
Symbol Value Unit  
°C/W  
JunctiontoAmbient – Steady State (Note 1)  
JunctiontoAmbient – t v 10 s (Note 1)  
JunctiontoFoot (Drain)  
R
R
75.5  
50.5  
22  
q
q
JA  
JA  
R
R
q
JF  
JunctiontoAmbient – Steady State (Note 2)  
138  
q
JA  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surfacemounted on FR4 board using 1 in sq pad size.  
2. Surfacemounted on FR4 board using the minimum recommended pad size.  
© Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
December, 2008 Rev. 0  
NTMS4802N/D  
 

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