NTMS4802N
Power MOSFET
30 V, 18 A, N−Channel, SO−8
Features
• Low R
to Minimize Conduction Losses
DS(on)
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• This is a Pb−Free Device
http://onsemi.com
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
Applications
4.0 mW @ 10 V
5.5 mW @ 4.5 V
30 V
18 A
• DC−DC Converters
• Synchronous MOSFET
• Printers
N−Channel
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
D
Parameter
Drain−to−Source Voltage
Symbol Value Unit
V
30
20
V
V
A
DSS
Gate−to−Source Voltage
V
GS
G
Continuous Drain
I
D
T = 25°C
15
A
Current R
(Note 1)
q
JA
T = 70°C
A
12
S
Power Dissipation R
(Note 1)
T = 25°C
P
1.66
W
A
q
A
D
JA
JA
MARKING DIAGRAM/
PIN ASSIGNMENT
Continuous Drain
I
D
T = 25°C
A
11.1
8.9
Current R
(Note 2)
q
JA
T = 70°C
A
Steady
State
1
8
Source
Source
Source
Gate
Drain
Drain
Drain
Drain
Power Dissipation R
(Note 2)
T = 25°C
A
P
I
0.91
W
A
1
q
D
SO−8
CASE 751
STYLE 12
Continuous Drain
T = 25°C
A
18
15
D
Current R , t v 10 s
q
JA
T = 70°C
A
(Note 1)
Top View
Power Dissipation
T = 25°C
A
P
D
2.5
W
4802N = Device Code
R
, t v 10 s(Note 1)
q
JA
A
= Assembly Location
Y
= Year
= Work Week
= Pb−Free Package
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
60
A
A
p
WW
G
Operating Junction and Storage Temperature
T ,
−55 to
150
°C
J
stg
T
(Note: Microdot may be in either location)
Source Current (Body Diode)
I
S
2.5
A
Single Pulse Drain−to−Source Avalanche Energy
E
420
mJ
AS
ORDERING INFORMATION
(T = 25°C, V = 30 V, V = 10 V,
J
DD
GS
†
I = 29 A , L = 1.0 mH, R = 25 W)
Device
Package
Shipping
2500/Tape & Reel
L
pk
G
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
NTMS4802NR2G
SO−8
(Pb−Free)
THERMAL RESISTANCE MAXIMUM RATINGS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Parameter
Symbol Value Unit
°C/W
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – t v 10 s (Note 1)
Junction−to−Foot (Drain)
R
R
75.5
50.5
22
q
q
JA
JA
R
R
q
JF
Junction−to−Ambient – Steady State (Note 2)
138
q
JA
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 in sq pad size.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
© Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
December, 2008 − Rev. 0
NTMS4802N/D