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NTMS4705NR2 PDF预览

NTMS4705NR2

更新时间: 2024-11-09 06:00:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 91K
描述
Power MOSFET 30 V, 12 A, Single N-Channel, SO-8

NTMS4705NR2 数据手册

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NTMS4705N  
Power MOSFET  
30 V, 12 A, Single N-Channel, SO-8  
Features  
ꢀLow R  
DS(on)  
ꢀLow Gate Charge  
http://onsemi.com  
ꢀStandard SO-8 Single Package  
ꢀPb-Free Package is Available  
Applications  
V
R
TYP  
I MAX  
D
(Note 1)  
(BR)DSS  
DS(ON)  
ꢀNotebooks, Graphics Cards  
ꢀSynchronous Rectification  
ꢀHigh Side Switch  
8.0 mW @ 10 V  
30 V  
12 A  
10.5 mW @ 4.5 V  
ꢀDC-DC Converters  
N-Channel  
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain-to-Source Voltage  
Symbol Value Unit  
V
30  
20  
V
V
A
DSS  
Gate-to-Source Voltage  
V
GS  
G
T = 25°C  
10  
Continuous Drain  
Current (Note 1)  
Steady  
State  
I
D
A
S
T = 85°C  
A
7.2  
12  
t v 10 s T = 25°C  
A
Steady  
State  
1.52  
Power Dissipation  
(Note 1)  
T = 25°C  
A
P
D
W
MARKING DIAGRAM/  
PIN ASSIGNMENT  
t v 10 s  
2.3  
7.4  
1
8
T = 25°C  
Continuous Drain  
Current (Note 2)  
Steady  
State  
I
D
A
A
Source  
Source  
Source  
Gate  
Drain  
Drain  
Drain  
Drain  
1
T = 85°C  
A
5.3  
SO-8  
CASE 751  
STYLE 12  
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
D
0.85  
W
Top View  
Pulsed Drain Current  
t = 10 ms  
p
I
36  
A
DM  
Operating Junction and Storage Temperature  
T ,  
J
T
stg  
-55 to  
150  
°C  
4705N = Device Code  
A
= Assembly Location  
= Year  
= Work Week  
Y
Source Current (Body Diode)  
I
S
3.0  
A
WW  
G
Single Pulse Drain-to-Source Avalanche Energy  
(V = 25 V, V = 10 V, Peak I = 7.5 A,  
E
AS  
210  
mJ  
= Pb-Free Package  
DD GS  
L = 10 mH, R = 25 W)  
L
(Note: Microdot may be in either location)  
G
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
THERMAL RESISTANCE MAXIMUM RATINGS  
Device  
Package  
Shipping  
Parameter  
Symbol Value Unit  
NTMS4705NR2  
SO-8  
2500/Tape & Reel  
2500/Tape & Reel  
Junction-to-Ambient – Steady State (Note 1)  
Junction-to-Ambient – t v 10 s (Note 1)  
Junction-to-Ambient – Steady State (Note 2)  
R
R
R
82  
55  
°C/W  
q
q
q
JA  
JA  
JA  
NTMS4705NR2G  
SO-8  
(Pb-Free)  
147  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [1 oz] including traces).  
2. Surface mounted on FR4 board using the minimum recommended pad size.  
©ꢀ Semiconductor Components Industries, LLC, 2007  
October, 2007 - Rev. 3  
1
Publication Order Number:  
NTMS4705N/D  
 

NTMS4705NR2 替代型号

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