NTMS4705N
Power MOSFET
30 V, 12 A, Single N-Channel, SO-8
Features
•ꢀLow R
DS(on)
•ꢀLow Gate Charge
http://onsemi.com
•ꢀStandard SO-8 Single Package
•ꢀPb-Free Package is Available
Applications
V
R
TYP
I MAX
D
(Note 1)
(BR)DSS
DS(ON)
•ꢀNotebooks, Graphics Cards
•ꢀSynchronous Rectification
•ꢀHigh Side Switch
8.0 mW @ 10 V
30 V
12 A
10.5 mW @ 4.5 V
•ꢀDC-DC Converters
N-Channel
D
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain-to-Source Voltage
Symbol Value Unit
V
30
20
V
V
A
DSS
Gate-to-Source Voltage
V
GS
G
T = 25°C
10
Continuous Drain
Current (Note 1)
Steady
State
I
D
A
S
T = 85°C
A
7.2
12
t v 10 s T = 25°C
A
Steady
State
1.52
Power Dissipation
(Note 1)
T = 25°C
A
P
D
W
MARKING DIAGRAM/
PIN ASSIGNMENT
t v 10 s
2.3
7.4
1
8
T = 25°C
Continuous Drain
Current (Note 2)
Steady
State
I
D
A
A
Source
Source
Source
Gate
Drain
Drain
Drain
Drain
1
T = 85°C
A
5.3
SO-8
CASE 751
STYLE 12
Power Dissipation
(Note 2)
T = 25°C
A
P
D
0.85
W
Top View
Pulsed Drain Current
t = 10 ms
p
I
36
A
DM
Operating Junction and Storage Temperature
T ,
J
T
stg
-55 to
150
°C
4705N = Device Code
A
= Assembly Location
= Year
= Work Week
Y
Source Current (Body Diode)
I
S
3.0
A
WW
G
Single Pulse Drain-to-Source Avalanche Energy
(V = 25 V, V = 10 V, Peak I = 7.5 A,
E
AS
210
mJ
= Pb-Free Package
DD GS
L = 10 mH, R = 25 W)
L
(Note: Microdot may be in either location)
G
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
ORDERING INFORMATION
THERMAL RESISTANCE MAXIMUM RATINGS
†
Device
Package
Shipping
Parameter
Symbol Value Unit
NTMS4705NR2
SO-8
2500/Tape & Reel
2500/Tape & Reel
Junction-to-Ambient – Steady State (Note 1)
Junction-to-Ambient – t v 10 s (Note 1)
Junction-to-Ambient – Steady State (Note 2)
R
R
R
82
55
°C/W
q
q
q
JA
JA
JA
NTMS4705NR2G
SO-8
(Pb-Free)
147
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size.
©ꢀ Semiconductor Components Industries, LLC, 2007
October, 2007 - Rev. 3
1
Publication Order Number:
NTMS4705N/D