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NTMFSC0D9N04CL PDF预览

NTMFSC0D9N04CL

更新时间： 2024-09-16 11:11:35
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 367K
描述
Power MOSFET, 40V N Channel __A 0.9m Ohm in Dualcool56 package

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NTMFSC0D9N04CL 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel, DUAL COOL),  
DFN8 5x6  
V
R
MAX  
I MAX  
D
SSS  
SS(ON)  
0.85 mW @ 10 V  
1.3 mW @ 4.5 V  
40 V  
313 A  
40 V, 0.85 mW, 313 A  
NTMFSC0D9N04CL  
Features  
• Advanced Dual−Sided Cooled Packaging  
DFN8 5x6  
CASE 506EG  
• Ultra Low R  
to Minimize Conduction Losses  
DS(on)  
• MSL1 Robust Packaging Design  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
MARKING DIAGRAM  
Typical Applications  
3KAYWZ  
• Orring FET/Load Switching  
• Synchronous Rectifier  
• DC−DC Conversion  
MAXIMUM RATINGS (T = 25°C, Unless otherwise specified)  
J
3K  
A
Y
= Specific Device Code  
= Assembly Location  
= Year  
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
W
Z
= Work Week  
= Assembly Lot Code  
Gate−to−Source Voltage  
V
20  
V
GS  
Continuous Drain  
Current R  
I
313  
A
D
q
JC  
Steady  
State  
(Note 2)  
N−Channel MOSFET  
T
= 25°C  
C
Power Dissipation  
P
167  
W
A
D
R
(Note 2)  
q
JC  
S
S
S
1
8
D
D
D
Continuous Drain  
Current R  
I
49.5  
D
q
JA  
2
3
7
6
Steady  
State  
(Note 1, 2)  
T = 25°C  
A
Power Dissipation  
P
3.8  
W
D
R
(Note 1, 2)  
q
JA  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
900  
A
A
p
G
4
5
D
Operating Junction and Storage Temperature  
Range  
T , T  
−55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
169  
706  
A
S
ORDERING INFORMATION  
See detailed ordering and shipping information on page 5 of  
this data sheet.  
Single Pulse Drain−to−Source Avalanche  
E
AS  
mJ  
Energy (I  
= 29 A)  
L(pk)  
Lead Temperature Soldering Reflow for Sol-  
dering Purposes (1/8″ from case for 10 s)  
T
L
300  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surface−mounted on FR4 board using 1 in pad size, 1 oz Cu pad.  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
February, 2023 − Rev. 7  
NTMFSC0D9N04CL/D  
 
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