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NTMFSC011N08M7 PDF预览

NTMFSC011N08M7

更新时间： 2024-09-16 11:14:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 395K
描述
N-Channel Dual CoolTM 56 PowerTrench® MOSFET 80V, 61A, 10mΩ

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NTMFSC011N08M7 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel, DUAL COOL)  
80 V, 10 mW, 61 A  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
80 V  
10 mW @ 10 V  
61 A  
N−Channel MOSFET  
D (5−8)  
NTMFSC011N08M7  
Features  
• DUAL COOL Top Side Cooling PQFN Package  
G (1)  
• Max r  
= 10 mW at V = 10 V, I = 10 A  
GS D  
DS(on)  
• High Performance Technology for Extremely Low r  
• 100% UIL Tested  
DS(on)  
S (2−4)  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
80  
Unit  
V
V
DSS  
DFN8 5x6  
Gate−to−Source Voltage  
V
GS  
20  
V
(Dual Cool 56)  
CASE 506EG  
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
61  
A
C
D
q
JC  
T
C
38.6  
78.1  
31.2  
12.5  
7.9  
(Notes 1, 3)  
MARKING DIAGRAM  
Power Dissipation  
T
C
P
W
A
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
3HAYWZ  
Continuous Drain  
Current R  
Steady  
State  
T = 25°C  
A
I
D
q
JA  
T = 100°C  
A
(Notes 1, 2, 3)  
Power Dissipation  
T = 25°C  
P
D
3.3  
W
A
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
1.3  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
180  
A
A
p
3H  
A
Y
= Specific Device Code  
= Assembly Location  
= Year  
Operating Junction and Storage Temperature  
Range  
T , T  
−55 to  
+150  
°C  
J
stg  
W
Z
= Work Week  
= Assembly Lot Code  
Source Current (Body Diode)  
I
S
61  
A
Single Pulse Drain−to−Source Avalanche  
E
AS  
640  
mJ  
Energy (I  
= 3.9 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
T
260  
°C  
L
ORDERING INFORMATION  
(1/8″ from case for 10 s)  
Device  
NTMFSC011N08M7  
Package  
Shipping  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Surface−mounted on FR4 board using a 1 in pad size, 1 oz Cu pad.  
DFN8  
3000 / Tape  
& Reel  
(Pb−Free)  
2
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
January, 2023 − Rev. 4  
NTMFSC011N08M7/D  
 
12345678

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