Datasheet > NTMFSC0D8N04XMTWG

NTMFSC0D8N04XMTWG

更新时间： 2024-11-06 17:15:43

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
4页	241K
描述
MOSFET - Power, SingleN-Channel, DUAL COOL40 V, 0.78mΩ, 310 A

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NTMFSC0D8N04XMTWG 数据手册

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DATA SHEET

www.onsemi.com

MOSFET - Power, Single

N-Channel, DUAL COOL⁾

40 V, 0.78 mW, 310 A

MAX

I MAX

SSS

SS(ON)

40 V

0.78 mW @ 10 V

310 A

Product Preview

NTMFSC0D8N04XM

Features

• Advanced Dual−Sided Cooling Package

• Latest 40 V Power MOSFET Technology for Motor Drive

DFN8 5x6

CASE 506EG

Applications

• Extreme Lower On−Resistance to Minimize Conduction Losses

• Lower Gate Charge to Minimize Gate Driving and Switching Losses

MARKING DIAGRAM

• Soft Body Diode Reverse Recovery

• These Devices are Pb−Free, Halogen Free and are RoHS Compliant

Typical Applications

3RAYWZ

• Motor Drive

• ORing FET

• Battery Protection

MAXIMUM RATINGS (T = 25°C, Unless otherwise specified)

= Specific Device Code

= Assembly Location

= Year

= Work Week

= Assembly Lot Code

Parameter

Drain−to−Source Voltage

Symbol

Value

Unit

DSS

Gate−to−Source Voltage

Continuous Drain

310

Current R

(Note 2)

N−Channel MOSFET

Steady

State

= 25°C

Power Dissipation

(Note 2)

135

Continuous Drain

Current R

Steady

State

(Note 1, 2)

T = 25°C

Power Dissipation

3.8

(Note 1, 2)

Pulsed Drain Current

T = 25°C, t = 10 ms

TBD

Pulsed Source Cur-

rent (Body Diode)

T = 25°C, t = 10 ms

Operating Junction and Storage Temperature

Range

T , T

−55 to

°C

ORDERING INFORMATION

See detailed ordering and shipping information on page 3 of

this data sheet.

stg

+175

Source Current (Body Diode) R

112

Single Pulse Drain−to−Source Avalanche

Energy (I = TBD A)

TBD

L(pk)

Lead Temperature Soldering Reflow for

Soldering Purposes (1/8″ from case for 10 s)

300

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. Surface−mounted on FR4 board using 1 in pad size, 1 oz Cu pad.

2. The entire application environment impacts the thermal resistance values shown,

they are not constants and are only valid for the particular conditions noted.

This document contains information on a product under development. onsemi reserves

the right to change or discontinue this product without notice.

Publication Order Number:

August, 2023 − Rev. P0

NTMFSC0D8N04XM/D

12 3 4

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