MOSFET - Power, Single
N-Channel
80 V, 3.2 mW, 135 A
NTMFS6H818NL
Features
www.onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
• These Devices are Pb−Free and are RoHS Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
3.2 mW @ 10 V
4.1 mW @ 4.5 V
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
80 V
135 A
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
V
DSS
Gate−to−Source Voltage
V
GS
20
V
D (5,6)
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
135
95
A
C
D
q
JC
T
C
(Notes 1, 3)
Steady
State
Power Dissipation
T
C
P
140
70
W
A
D
G (4)
R
(Note 1)
q
JC
T
C
= 100°C
Continuous Drain
Current R
T = 25°C
A
I
D
22
S (1,2,3)
N−CHANNEL MOSFET
q
JA
T = 100°C
A
16
(Notes 1, 2, 3)
Steady
State
Power Dissipation
T = 25°C
A
P
3.8
1.9
772
W
D
R
(Notes 1, 2)
q
JA
T = 100°C
A
MARKING
DIAGRAM
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
D
Operating Junction and Storage Temperature
Range
T , T
−55 to
°C
J
stg
1
+175
S
S
S
G
D
D
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
6H818L
AYWZZ
Source Current (Body Diode)
I
S
116
707
A
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (I
= 9.3 A)
L(pk)
D
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
A
Y
= Assembly Location
= Year
W
ZZ
= Work Week
= Lot Traceability
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Parameter
Symbol
Value
1.1
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
39
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
March, 2020 − Rev. 0
NTMFS6H818NL/D