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NTMFS6H818NT1G PDF预览

NTMFS6H818NT1G

更新时间: 2024-09-16 11:12:59
品牌 Logo 应用领域
安森美 - ONSEMI 脉冲光电二极管晶体管
页数 文件大小 规格书
7页 206K
描述
单 N 沟道,功率 MOSFET,80V,123A,3.7mΩ

NTMFS6H818NT1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SO-8FL, DFN5, 5 PINReach Compliance Code:not_compliant
Factory Lead Time:20 weeks风险等级:1.52
雪崩能效等级(Eas):731 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:80 V
最大漏极电流 (Abs) (ID):123 A最大漏极电流 (ID):123 A
最大漏源导通电阻:0.0057 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-F5JESD-609代码:e3
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):136 W最大脉冲漏极电流 (IDM):900 A
表面贴装:YES端子面层:Tin (Sn)
端子形式:FLAT端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管元件材料:SILICON
Base Number Matches:1

NTMFS6H818NT1G 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – Power, Single,  
N-Channel  
80 V, 3.7 mW, 123 A  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
80 V  
3.7 m@ 10 V  
123 A  
NTMFS6H818N  
D (5)  
Features  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Q and Capacitance to Minimize Driver Losses  
DS(on)  
G (4)  
G
These Devices are PbFree and are RoHS Compliant  
S (1,2,3)  
NCHANNEL MOSFET  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
V
DSS  
MARKING  
DIAGRAM  
GatetoSource Voltage  
V
GS  
20  
V
D
Continuous Drain  
Current R  
T
= 25°C  
I
123  
A
C
D
1
JC  
S
S
S
G
D
D
T
C
= 100°C  
87  
(Notes 1, 3)  
Steady  
State  
DFN5  
(SO8FL)  
CASE 488AA  
STYLE 1  
6H818N  
AYWZZ  
Power Dissipation  
T
C
= 25°C  
P
136  
68  
W
A
D
R
(Note 1)  
JC  
T
C
= 100°C  
D
Continuous Drain  
Current R  
T = 25°C  
A
I
D
20  
A
Y
= Assembly Location  
= Year  
JA  
T = 100°C  
A
14  
(Notes 1, 2, 3)  
Steady  
State  
W
ZZ  
= Work Week  
= Lot Traceability  
Power Dissipation  
T = 25°C  
A
P
3.8  
1.9  
900  
W
D
R
(Notes 1 & 2)  
JA  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 s  
I
DM  
A
A
p
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Operating Junction and Storage Temperature  
T , T  
55 to  
+ 175  
°C  
J
stg  
Source Current (Body Diode)  
I
113  
731  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 9.3 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
Unit  
JunctiontoCase Steady State  
R
1.1  
39  
°C/W  
JC  
JunctiontoAmbient Steady State (Note 2)  
R
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
September, 2021 Rev. 2  
NTMFS6H818N/D  
 

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