NTMFS6D1N08H
MOSFET – Power, Single,
N-Channel
80 V, 5.5 mW, 89 A
Features
www.onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• These Devices are Pb−Free, Halogen Free/BFR Free, Beryllium Free
and are RoHS Compliant
5.5 mW @ 10 V
8.0 mW @ 6 V
80 V
89 A
Typical Applications
• Synchronous Rectification
• AC−DC and DC−DC Power Supplies
• AC−DC Adapters (USB PD) SR
• Load Switch
D (5,6)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
G (4)
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
V
DSS
S (1,2,3)
N−CHANNEL MOSFET
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
T
= 25°C
I
89
A
C
D
Current R
(Note 1)
q
JC
Steady
State
MARKING
DIAGRAM
Power Dissipation
(Note 1)
P
104
17
W
A
D
R
q
JC
D
Continuous Drain
Current R
T = 25°C
A
I
D
1
S
S
S
G
D
D
q
JA
Steady
State
(Notes 1, 2)
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
6D1N08
AYWZZ
Power Dissipation
P
3.8
W
D
R
(Notes 1, 2)
q
JA
D
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
468
A
A
p
A
Y
W
ZZ
= Assembly Location
= Year
= Work Week
= Lot Traceability
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
Source Current (Body Diode)
I
S
87
A
Single Pulse Drain−to−Source Avalanche
E
AS
465
mJ
Energy (I = 5.9 A)
AV
ORDERING INFORMATION
Lead Temperature Soldering Reflow for Solder-
T
300
°C
L
ing Purposes (1/8″ from case for 10 s)
Device
NTMFS6D1N08HT1G
Package
Shipping†
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
DFN5
1500 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Value
1.44
40
Unit
Junction−to−Case − Steady State (Note 1)
Junction−to−Ambient − Steady State (Note 1)
R
°C/W
q
JC
R
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using 1 in pad size, 1 oz. Cu pad.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
May, 2019 − Rev. 3
NTMFS6D1N08H/D