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NTJD4001NT2G PDF预览

NTJD4001NT2G

更新时间: 2024-09-14 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管
页数 文件大小 规格书
5页 72K
描述
Dual N-Channel Small Signal MOSFET 30V 250mA 1.5Ω

NTJD4001NT2G 数据手册

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NTJD4001N, NVTJD4001N  
Small Signal MOSFET  
30 V, 250 mA, Dual N−Channel, SC−88  
Features  
Low Gate Charge for Fast Switching  
Small Footprint − 30% Smaller than TSOP−6  
ESD Protected Gate  
www.onsemi.com  
V
R
TYP  
I Max  
D
AEC Q101 Qualified − NVTJD4001N  
These Devices are Pb−Free and are RoHS Compliant  
(BR)DSS  
DS(on)  
1.0 W @ 4.0 V  
1.5 W @ 2.5 V  
250 mA  
30 V  
Applications  
Low Side Load Switch  
Li−Ion Battery Supplied Devices − Cell Phones, PDAs, DSC  
Buck Converters  
Level Shifts  
SOT−363  
SC−88 (6 LEADS)  
S
1
G
1
D
2
1
6
5
4
D
1
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value Units  
2
3
G
S
2
V
DSS  
30  
20  
V
V
Gate−to−Source Voltage  
V
GS  
Continuous Drain  
Current (Note 1)  
Steady T = 25 °C  
I
D
250  
180  
272  
mA  
A
2
State  
T = 85 °C  
A
Top View  
Power Dissipation  
(Note 1)  
Steady T = 25 °C  
P
D
mW  
A
State  
MARKING DIAGRAM &  
PIN ASSIGNMENT  
D1 G2 S2  
Pulsed Drain Current  
t =10 ms  
I
600  
mA  
DM  
Operating Junction and Storage Temperature  
T , T  
−55 to  
150  
°C  
J
STG  
6
Source Current (Body Diode)  
I
250  
260  
mA  
1
S
TE M G  
SOT−363  
CASE 419B  
STYLE 26  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
°C  
T
G
L
1
THERMAL RESISTANCE RATINGS (Note 1)  
S1 G1 D2  
Parameter  
Symbol  
Value  
458  
Unit  
TE  
M
G
= Device Code  
= Date Code  
= Pb−Free Package  
Junction−to−Ambient − Steady State  
Junction−to−Lead − Steady State  
R
°C/W  
q
JA  
R
252  
q
JL  
(Note: Microdot may be in either location)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
1. Surface mounted on FR4 board using min pad size  
(Cu area = 0.155 in sq [1 oz] including traces).  
Device  
NTJD4001NT1G  
Package  
Shipping  
SOT−363  
(Pb−Free)  
3000 / Tape &  
Reel  
NVTJD4001NT1G SOT−363  
(Pb−Free)  
3000 / Tape &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
May, 2015 − Rev. 7  
NTJD4001N/D  
 

NTJD4001NT2G 替代型号

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