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NTJS3151PT1 PDF预览

NTJS3151PT1

更新时间: 2024-09-15 02:54:59
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 134K
描述
Trench Power MOSFET 12 V, 3.3 A, Single P−Channel, ESD Protected SC−88

NTJS3151PT1 数据手册

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NTJS3151P  
Trench Power MOSFET  
12 V, 3.3 A, Single PChannel,  
ESD Protected SC88  
Features  
http://onsemi.com  
Leading Trench Technology for Low R  
Extending Battery Life  
DS(ON)  
SC88 Small Outline (2x2 mm, SC706 Equivalent)  
Gate Diodes for ESD Protection  
V
R
Typ  
I Max  
D
(BR)DSS  
DS(on)  
45 mW @ 4.5 V  
67 mW @ 2.5 V  
PbFree Packages are Available  
12 V  
3.3 A  
Applications  
133 mW @ 1.8 V  
High Side Load Switch  
Cell Phones, Computing, Digital Cameras, MP3s and PDAs  
SC88 (SOT363)  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
D
D
1
2
3
6
D
D
S
J
Parameter  
DraintoSource Voltage  
Symbol  
Value Units  
V
DSS  
12  
12  
V
V
A
5
4
GatetoSource Voltage  
V
GS  
Continuous Drain  
Current (Note 1)  
Steady T = 25 °C  
I
D
2.7  
2.0  
3.3  
0.625  
A
State  
G
T = 85 °C  
A
t 5 s  
T = 25 °C  
A
Top View  
D
Power Dissipation  
(Note 1)  
Steady T = 25 °C  
P
D
W
A
State  
Pulsed Drain Current  
t = 10 ms  
p
I
8.0  
A
3 kW  
DM  
G
Operating Junction and Storage Temperature  
T ,  
STG  
55 to  
150  
°C  
J
T
Source Current (Body Diode)  
I
S
0.8  
A
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
260  
°C  
T
L
S
THERMAL RESISTANCE RATINGS (Note 1)  
MARKING DIAGRAM &  
PIN ASSIGNMENT  
Parameter  
Symbol  
Max  
200  
141  
102  
Units  
D
D
S
JunctiontoAmbient – Steady State  
JunctiontoAmbient t 5 s  
JunctiontoLead – Steady State  
R
°C/W  
q
JA  
6
1
R
q
JA  
TJ M G  
SC88/SOT363  
CASE 419B  
R
q
JL  
G
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 in sq pad size  
STYLE 28  
1
D
D
G
TJ  
M
G
= Device Code  
= Date Code  
= PbFree Package  
(Cu area = 1.127 in sq [1 oz] including traces).  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
March, 2006 Rev. 2  
NTJS3151/D  

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