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NTK3139P PDF预览

NTK3139P

更新时间: 2024-11-26 03:45:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 60K
描述
Power MOSFET −20 V, −780 mA, Single P−Channel with ESD Protection, SOT−723

NTK3139P 数据手册

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NTK3139P  
Power MOSFET  
−20 V, 780 mA, Single P−Channel with  
ESD Protection, SOT−723  
Features  
http://onsemi.com  
P−channel Switch with Low R  
DS(on)  
44% Smaller Footprint and 38% Thinner than SC−89  
V
R
TYP  
I Max  
D
(BR)DSS  
DS(on)  
Low Threshold Levels Allowing 1.5 V R  
Operated at Low Logic Level Gate Drive  
These are Pb−Free Devices  
Rating  
0.38 W @ −4.5 V  
0.52 W @ −2.5 V  
0.70 W @ −1.8 V  
0.95 W @ −1.5 V  
−780 mA  
−660 mA  
−100 mA  
−100 mA  
DS(on)  
−20 V  
Applications  
Load/Power Switching  
Interfacing, Logic Switching  
Battery Management for Ultra Small Portable Electronics  
SOT−723 (3−LEAD)  
3
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain−to−Source Voltage  
Gate−to−Source Voltage  
Symbol  
Value  
−20  
Unit  
V
V
DSS  
V
6
V
GS  
Continuous Drain  
Current (Note 1)  
Steady  
State  
T = 25°C  
I
−780  
−570  
−870  
450  
mA  
A
D
1
2
T = 85°C  
A
t v 5 s  
T = 25°C  
A
Top View  
1 − Gate  
2 − Source  
3 − Drain  
Power Dissipation  
(Note 1)  
Steady  
State  
T = 25°C  
A
P
mW  
mA  
D
t v 5 s  
550  
−660  
−480  
310  
Continuous Drain  
Current (Note 2)  
Steady  
State  
T = 25°C  
A
I
D
MARKING DIAGRAM  
T = 85°C  
A
KD M  
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
mW  
A
D
SOT−723  
1
CASE 631AA  
STYLE 5  
Pulsed Drain Cur-  
rent  
t = 10 ms  
p
I
−1.2  
DM  
KD = Specific Device Code  
M
= Date Code  
Operating Junction and Storage Tempera-  
ture  
T , T  
−55 to  
150  
°C  
°C  
J
STG  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
260  
L
ORDERING INFORMATION  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq  
[1 oz] including traces)  
Device  
Package  
Shipping  
NTK3139PT1G  
NTK3139PT5G  
SOT−723* 4000 / Tape & Reel  
SOT−723* 8000 / Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
2. Surface mounted on FR4 board using the minimum recommended pad size  
*These packages are inherently Pb−Free.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
December, 2006 − Rev. 0  
NTK3139P/D  
 

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