NTK3139P
Power MOSFET
−20 V, −780 mA, Single P−Channel with
ESD Protection, SOT−723
Features
http://onsemi.com
• P−channel Switch with Low R
DS(on)
• 44% Smaller Footprint and 38% Thinner than SC−89
V
R
TYP
I Max
D
(BR)DSS
DS(on)
• Low Threshold Levels Allowing 1.5 V R
• Operated at Low Logic Level Gate Drive
• These are Pb−Free Devices
Rating
0.38 W @ −4.5 V
0.52 W @ −2.5 V
0.70 W @ −1.8 V
0.95 W @ −1.5 V
−780 mA
−660 mA
−100 mA
−100 mA
DS(on)
−20 V
Applications
• Load/Power Switching
• Interfacing, Logic Switching
• Battery Management for Ultra Small Portable Electronics
SOT−723 (3−LEAD)
3
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
−20
Unit
V
V
DSS
V
6
V
GS
Continuous Drain
Current (Note 1)
Steady
State
T = 25°C
I
−780
−570
−870
450
mA
A
D
1
2
T = 85°C
A
t v 5 s
T = 25°C
A
Top View
1 − Gate
2 − Source
3 − Drain
Power Dissipation
(Note 1)
Steady
State
T = 25°C
A
P
mW
mA
D
t v 5 s
550
−660
−480
310
Continuous Drain
Current (Note 2)
Steady
State
T = 25°C
A
I
D
MARKING DIAGRAM
T = 85°C
A
KD M
Power Dissipation
(Note 2)
T = 25°C
A
P
mW
A
D
SOT−723
1
CASE 631AA
STYLE 5
Pulsed Drain Cur-
rent
t = 10 ms
p
I
−1.2
DM
KD = Specific Device Code
M
= Date Code
Operating Junction and Storage Tempera-
ture
T , T
−55 to
150
°C
°C
J
STG
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
L
ORDERING INFORMATION
†
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces)
Device
Package
Shipping
NTK3139PT1G
NTK3139PT5G
SOT−723* 4000 / Tape & Reel
SOT−723* 8000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2. Surface mounted on FR4 board using the minimum recommended pad size
*These packages are inherently Pb−Free.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
December, 2006 − Rev. 0
NTK3139P/D