NTJS4151P
Trench Power MOSFET
−20 V, −4.2 A, Single P−Channel, SC−88
Features
• Leading Trench Technology for Low R
Extending Battery Life
• SC−88 Small Outline (2x2 mm) for Maximum Circuit Board
Utilization, Same as SC−70−6
http://onsemi.com
DS(ON)
V
R
Typ
I Max
D
(BR)DSS
DS(on)
47 mW @ −4.5 V
70 mW @ −2.5 V
180 mW @ −1.8 V
• Gate Diodes for ESD Protection
−4.2 A
−20 V
• Pb−Free Package is Available
Applications
• High Side Load Switch
SC−88 (SOT−363)
• Cell Phones, Computing, Digital Cameras, MP3s and PDAs
D
D
1
2
3
6
D
D
S
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
−20
12
Unit
V
5
4
V
DSS
Gate−to−Source Voltage
V
GS
V
G
Continuous Drain
Current (Note 1)
Steady T = 25 °C
State
I
−3.3
−2.4
−4.2
1.0
A
A
D
T = 85 °C
A
Top View
t ≤ 5 s T = 25 °C
A
MARKING DIAGRAM &
PIN ASSIGNMENT
Power Dissipation
(Note 1)
Steady T = 25 °C
State
P
W
A
D
D
D
S
Pulsed Drain Current
t = 10 ms
I
−10
A
p
DM
6
Operating Junction and Storage Temperature
T ,
−55 to
150
1
°C
J
T
STG
TY M G
SC−88/SOT−363
CASE 419B
G
Source Current (Body Diode)
I
S
−1.3
A
1
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
260
°C
T
L
D
D
G
ESD
Human Body Model (HBM)
ESD
4000
V
TY
M
G
= Device Code
= Date Code
= Pb−Free Package
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol
Max
125
75
Unit
(Note: Microdot may be in either location)
Junction−to−Ambient – Steady State
Junction−to−Ambient − t ≤ 5 s
Junction−to−Lead – Steady State
R
°C/W
q
JA
R
q
JA
ORDERING INFORMATION
R
45
q
JL
†
Device
Package
Shipping
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
NTJS4151PT1
NTJS4151PT1G
SC−88
3000 / Tape & Reel
3000 / Tape & Reel
SC−88
(Pb−Free)
1. Surface mounted on FR4 board using 1 in sq pad size
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
(Cu area = 1.127 in sq [1 oz] including traces).
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 1
NTJS4151P/D