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NTK3139PT1H

更新时间: 2024-11-06 20:10:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 102K
描述
TRANSISTOR POWER, FET, FET General Purpose Power

NTK3139PT1H 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.65
JESD-609代码:e3湿度敏感等级:1
端子面层:Tin (Sn)Base Number Matches:1

NTK3139PT1H 数据手册

 浏览型号NTK3139PT1H的Datasheet PDF文件第2页浏览型号NTK3139PT1H的Datasheet PDF文件第3页浏览型号NTK3139PT1H的Datasheet PDF文件第4页浏览型号NTK3139PT1H的Datasheet PDF文件第5页 
NTK3139P  
Power MOSFET  
20 V, 780 mA, Single PChannel with  
ESD Protection, SOT723  
Features  
http://onsemi.com  
Pchannel Switch with Low R  
DS(on)  
44% Smaller Footprint and 38% Thinner than SC89  
V
R
TYP  
I Max  
D
(BR)DSS  
DS(on)  
Low Threshold Levels Allowing 1.5 V R  
Operated at Low Logic Level Gate Drive  
Rating  
0.38 W @ 4.5 V  
0.52 W @ 2.5 V  
0.70 W @ 1.8 V  
0.95 W @ 1.5 V  
780 mA  
660 mA  
100 mA  
100 mA  
DS(on)  
20 V  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
Applications  
Load/Power Switching  
Interfacing, Logic Switching  
Battery Management for Ultra Small Portable Electronics  
SOT723 (3LEAD)  
3
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Value  
20  
Unit  
V
V
DSS  
V
GS  
6
V
Continuous Drain  
Current (Note 1)  
Steady  
T = 25°C  
I
780  
570  
870  
450  
mA  
A
D
1
2
State  
T = 85°C  
A
Top View  
1 Gate  
2 Source  
3 Drain  
t v 5 s  
Steady  
State  
T = 25°C  
A
Power Dissipation  
(Note 1)  
T = 25°C  
A
P
mW  
mA  
D
t v 5 s  
Steady  
State  
550  
660  
480  
310  
MARKING DIAGRAM  
Continuous Drain  
Current (Note 2)  
T = 25°C  
A
I
D
T = 85°C  
A
KD M  
Power Dissipation  
(Note 2)  
T = 25°C  
A
P
mW  
A
SOT723  
D
1
CASE 631AA  
STYLE 5  
KD = Specific Device Code  
Pulsed Drain Cur-  
rent  
t = 10 ms  
p
I
1.2  
DM  
M
= Date Code  
Operating Junction and Storage Tempera-  
ture  
T , T  
55 to  
°C  
°C  
J
STG  
150  
ORDERING INFORMATION  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
T
L
260  
Device  
Package  
Shipping  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq  
[1 oz] including traces)  
NTK3139PT1G  
NTK3139PT1H  
NTK3139PT5G  
NTK3139PT5H  
4000 / Tape & Reel  
SOT723  
PbFree  
8000 / Tape & Reel  
2. Surface mounted on FR4 board using the minimum recommended pad size  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
September, 2013 Rev. 1  
NTK3139P/D  
 

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