NTK3134N
Power MOSFET
20 V, 890 mA, Single N−Channel with
ESD Protection, SOT−723
Features
http://onsemi.com
• N channel Switch with Low R
DS(on)
V
R
TYP
I Max
D
• 44% Smaller Footprint and 38% Thinner than SC89
(BR)DSS
DS(on)
0.20 W @ 4.5 V
0.26 W @ 2.5 V
0.42 W @ 1.8 V
0.62 W @ 1.5 V
890 mA
790 mA
700 mA
200 mA
• Low Threshold Levels Allowing 1.5 V R
• Operated at Low Logic Level Gate Drive
• These are Pb−Free Devices
Rating
DS(on)
20 V
Applications
• Load/Power Switching
• Interface Switching
• Logic Level Shift
SOT−723 (3−LEAD)
3
• Battery Management for Ultra Small Portable Electronics
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
20
Unit
V
V
DSS
V
6
V
GS
1
2
Continuous Drain
Current (Note 1)
Steady
State
T = 25°C
I
890
640
990
450
mA
A
D
Top View
T = 85°C
A
1 − Gate
2 − Source
3 − Drain
t ≤ 5 s
T = 25°C
A
Power Dissipation
(Note 1)
Steady
State
T = 25°C
A
P
mW
mA
D
t ≤ 5 s
550
750
540
310
MARKING DIAGRAM
Continuous Drain
Current (Note 2)
Steady
State
T = 25°C
A
I
D
T = 85°C
A
KF M
Power Dissipation
(Note 2)
T = 25°C
A
P
mW
A
SOT−723
D
1
CASE 631AA
STYLE 5
Pulsed Drain
Current
t = 10 ms
p
I
1.8
DM
KF = Specific Device Code
M
= Date Code
Operating Junction and Storage
Temperature
T , T
−55 to
150
°C
°C
J
STG
ORDERING INFORMATION
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T
260
L
†
Device
Package
Shipping
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces)
NTK3134NT1G
NTK3134NT5G
SOT−723* 4000 / Tape & Reel
SOT−723* 8000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2. Surface mounted on FR4 board using the minimum recommended pad size
*These packages are inherently Pb−Free.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
December, 2006 − Rev. 0
NTK3134N/D