NTL Series
Thin Film Chip Inductors
FEATURES
• ULTRA-SMALL LOW PROFILE 0201, 0402 & 0603SIZES
• HIGH Q (15 ~ 40) @ 300MHz ~ 1.5GHz
• S-PARAMETER CHARACTERISTICS AVAILABLE
• HIGH CURRENT & HIGH SRF
RoHS
Compliant
includes all homogeneous materials
• COMPATIBLE WITH Pb-FREE SOLDERING
• RoHS COMPLIANT
*See Part Number System for Details
CHARACTERISTICS
0201
0402
0603*
Case Size
1.0nH ~ 5.6nH
1.0nH ~ 15nH
1.0nH ~ 100nH
Inductance Range
Available Tolerance
Temperature Range
Resistance to Solder Heat
Temperature Cycling
±0.1nH (B), ±0.2nH (C) & 2% (G)
-40°C ~ +125°C
±0.2nH (C) & 2% (G)
270°C ±5°C for 10 seconds
ΔL±10% after 10 cycles -40°C/+20°C/+85°C/+20°C
*Not recommended for new designs (see NTI06 series)
CONSTRUCTION
PART NUMBER SYSTEM
NTL 02 C 33N TR F
RoHS compliant
Tape & Reel Packaging
Inductance Value in nano-henries,
"N" indicates decimal point
Inductance Tolerance (see values tables)
Case Code
Copper (Cu)
Termination Base
Series
2µm Nickel (Ni) Barrier
3µm Tin (Sn) Outerplating
CASE DIMENSIONS (mm)
Case Sixe
0201
L
W
T
P
Alumina Substrate
Etched Copper Coil
0.61 ± 0.05 0.31 ± 0.05 0.28 ± 0.05 0.12 ± 0.05
0402
1.0 ± 0.10
1.6 ± 0.10
0.5 ± 0.10 0.40 ± 0.10 0.25 ± 0.10
0.8 ± 0.10 0.45 ± 0.10 0.30 ± 0.10
T
0603
LAND PATTERN DIMENSIONS (mm)
W
P
Case Sixe
0201
A
B
C
D
0.2 ~ 0.3
0.5 ~ 0.6
0.6 ~ 1.0
0.8 ~ 0.9
1.5 ~ 1.8
2.4 ~ 2.8
0.2 ~ 0.3
0.5 ~ 0.6
0.7 ~ 0.9
0.3 ~ 0.4
0.5 ~ 0.6
0.9 ~ 1.1
L
0402
0603
REFLOW SOLDERING PROFILE
10 sec. max.
250°C max.
220°C
250°C
A
200°C
150°C
100°C
50°C
130°C ~ 180°C
C
B
D
Time above 220°C -
30 ~ 90 sec. max.
60 ~ 90 sec.
Time (seconds)
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
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