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NTJD4152PT2G PDF预览

NTJD4152PT2G

更新时间: 2024-11-01 20:57:27
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管
页数 文件大小 规格书
5页 73K
描述
SMALL SIGNAL, FET

NTJD4152PT2G 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G6Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:10 weeks
风险等级:5.71配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR
最小漏源击穿电压:20 V最大漏极电流 (ID):0.88 A
最大漏源导通电阻:0.26 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G6JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):0.35 W
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTJD4152PT2G 数据手册

 浏览型号NTJD4152PT2G的Datasheet PDF文件第2页浏览型号NTJD4152PT2G的Datasheet PDF文件第3页浏览型号NTJD4152PT2G的Datasheet PDF文件第4页浏览型号NTJD4152PT2G的Datasheet PDF文件第5页 
NTJD4152P, NVJD4152P  
Trench Small Signal  
MOSFET  
20 V, 0.88 A, Dual P−Channel,  
ESD Protected SC−88  
Features  
Leading Trench Technology for Low R  
Performance  
DS(ON)  
www.onsemi.com  
Small Footprint Package (SC70−6 Equivalent)  
ESD Protected Gate  
V
R
Typ  
I Max  
D
(BR)DSS  
DS(on)  
NV Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
215 mW @ −4.5 V  
345 mW @ −2.5 V  
−20 V  
−0.88 A  
These are Pb−Free Devices  
Applications  
600 mW @ −1.8 V  
Load/Power Management  
Charging Circuits  
S
1
2
3
6
5
4
D
1
1
Load Switching  
Cell Phones, Computing, Digital Cameras, MP3s and PDAs  
G
G
2
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
1
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
−20  
Unit  
V
V
DSS  
D
S
2
2
Gate−to−Source Voltage  
V
GS  
12  
V
Continuous Drain  
Current (Note 1)  
Steady T = 25°C  
I
−0.88  
−0.63  
0.272  
0.141  
−1.0  
−0.72  
0.35  
0.181  
3.0  
A
A
D
State  
Top View  
T = 85°C  
A
Power Dissipation  
(Note 1)  
Steady T = 25°C  
P
W
A
A
D
D
MARKING DIAGRAM &  
PIN ASSIGNMENT  
State  
T = 85°C  
A
Continuous Drain  
Current (Note 2)  
t v 5 s T = 25°C  
I
D
A
D1 G2 S2  
6
T = 85°C  
A
1
Power Dissipation  
(Note 2)  
t v 5 s T = 25°C  
P
W
A
SC−88/SOT−363  
CASE 419B  
STYLE 26  
XXX MG  
G
T = 85°C  
A
Pulsed Drain Current  
t 10 ms  
I
A
DM  
1
S1 G1 D2  
Operating Junction and Storage Temperature  
T ,  
−55 to  
150  
°C  
J
T
STG  
XXX  
M
G
= Device Code  
= Date Code  
= Pb−Free Package  
Continuous Source Current (Body Diode)  
I
S
−0.48  
260  
A
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
°C  
T
L
(Note: Microdot may be in either location)  
THERMAL RESISTANCE RATINGS (Note 1)  
Parameter  
Symbol Max Unit  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
Junction−to−Ambient – Steady State  
Junction−to−Ambient − t v 5 s  
Junction−to−Lead – Steady State  
R
R
460 °C/W  
357  
q
q
JA  
JA  
R
226  
q
JL  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Surface mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [1 oz] including traces), steady state.  
2. Surface mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [1 oz] including traces), t v 5 s.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
February, 2015 − Rev. 6  
NTJD4152P/D  
 

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