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NTJD5121N PDF预览

NTJD5121N

更新时间: 2024-09-15 06:00:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 77K
描述
Power MOSFET 60 V, 295 mA, Dual N-Channel with ESD Protection, SC-88

NTJD5121N 数据手册

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NTJD5121N  
Power MOSFET  
60 V, 295 mA, Dual N-Channel with ESD  
Protection, SC-88  
Features  
ꢀLow R  
DS(on)  
http://onsemi.com  
ꢀLow Gate Threshold  
ꢀLow Input Capacitance  
ꢀESD Protected Gate  
ꢀThis is a Pb-Free Device  
V
R
MAX  
I Max  
D
(BR)DSS  
DS(on)  
1.6 W @ 10 V  
2.5 W @ 4.5 V  
295 mA  
60 V  
Applications  
ꢀLow Side Load Switch  
ꢀDC-DC Converters (Buck and Boost Circuits)  
SC-88 (SOT-363)  
S
1
G
1
D
2
1
2
3
6
D
1
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain-to-Source Voltage  
Symbol  
Value Units  
5
G
2
V
DSS  
60  
V
V
Gate-to-Source Voltage  
V
GS  
20  
Continuous Drain  
Current (Note 1)  
Steady T = 25°C  
I
D
295  
212  
304  
219  
250  
mA  
A
4
S
2
State  
T = 85°C  
A
t 5 s T = 25°C  
A
Top View  
T = 85°C  
A
MARKING DIAGRAM &  
PIN ASSIGNMENT  
D1 G2 S2  
Power Dissipation  
(Note 1)  
Steady T = 25°C  
P
D
mW  
A
State  
t 5 s  
266  
900  
6
1
Pulsed Drain Current  
t = 10 ms  
p
I
mA  
DM  
TF MꢀG  
SC-88/SOT-363  
CASE 419B  
STYLE 26  
Operating Junction and Storage Temperature  
T , T  
J
-55 to  
150  
°C  
STG  
G
Source Current (Body Diode)  
I
S
210  
260  
mA  
1
S1 G1 D2  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
°C  
T
L
TF  
M
G
= Device Code  
= Date Code  
= Pb-Free Package  
Gate-Source ESD Rating  
(HBM, Method 3015)  
ESD  
1400  
V
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
THERMAL RESISTANCE RATINGS  
Device  
Package  
Shipping  
Parameter  
Symbol  
Value Units  
NTJD5121NT1G  
SC-88  
(Pb-Free)  
3000 / Tape & Reel  
Junction-to-Ambient – Steady State  
Junction-to-Ambient – t 5 s  
R
500  
470  
°C/W  
q
q
JA  
JA  
R
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
1. Surface mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [2 oz] including traces).  
©ꢀ Semiconductor Components Industries, LLC, 2008  
April, 2008 - Rev. 1  
1
Publication Order Number:  
NTJD5121N/D  

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