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NTJD5121NT2G PDF预览

NTJD5121NT2G

更新时间: 2024-11-01 12:04:59
品牌 Logo 应用领域
安森美 - ONSEMI 晶体小信号场效应晶体管开关光电二极管PC
页数 文件大小 规格书
5页 108K
描述
Power MOSFET 60 V, 295 mA, Dual N−Channel with ESD

NTJD5121NT2G 技术参数

是否无铅:不含铅生命周期:Active
零件包装代码:SC-88包装说明:SMALL OUTLINE, R-PDSO-G6
针数:6Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:23 weeks
风险等级:1.48Samacsys Confidence:3
Samacsys Status:ReleasedSamacsys PartID:284957
Samacsys Pin Count:6Samacsys Part Category:MOSFET (N-Channel)
Samacsys Package Category:SOT23 (6-Pin)Samacsys Footprint Name:SC?88/SC70?6/SOT?363
Samacsys Released Date:2020-04-09 05:52:41Is Samacsys:N
其他特性:LOW THRESHOLD配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):0.295 A
最大漏极电流 (ID):0.295 A最大漏源导通电阻:1.6 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G6
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):0.25 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NTJD5121NT2G 数据手册

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NTJD5121N  
Power MOSFET  
60 V, 295 mA, Dual NChannel with ESD  
Protection, SC88  
Features  
Low R  
DS(on)  
http://onsemi.com  
Low Gate Threshold  
Low Input Capacitance  
ESD Protected Gate  
This is a PbFree Device  
V
R
MAX  
I Max  
D
(BR)DSS  
DS(on)  
1.6 W @ 10 V  
2.5 W @ 4.5 V  
295 mA  
60 V  
Applications  
Low Side Load Switch  
DCDC Converters (Buck and Boost Circuits)  
SC88 (SOT363)  
S
1
G
1
D
2
1
2
3
6
D
1
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
5
G
2
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current (Note 1)  
Steady T = 25°C  
I
D
295  
212  
304  
219  
250  
mA  
A
4
S
2
State  
T = 85°C  
A
t 5 s T = 25°C  
A
Top View  
T = 85°C  
A
MARKING DIAGRAM &  
PIN ASSIGNMENT  
D1 G2 S2  
Power Dissipation  
(Note 1)  
Steady T = 25°C  
P
D
mW  
A
State  
t 5 s  
266  
900  
6
1
Pulsed Drain Current  
t = 10 ms  
p
I
mA  
DM  
TF M G  
SC88/SOT363  
CASE 419B  
STYLE 26  
Operating Junction and Storage Temperature  
T , T  
55 to  
°C  
J
STG  
G
150  
Source Current (Body Diode)  
I
S
210  
260  
mA  
1
S1 G1 D2  
= Device Code  
= Date Code  
= PbFree Package  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
°C  
T
L
TF  
M
G
GateSource ESD Rating (HBM)  
GateSource ESD Rating (MM)  
ESD  
ESD  
2000  
200  
V
V
HBM  
(Note: Microdot may be in either location)  
MM  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
THERMAL RESISTANCE RATINGS  
NTJD5121NT1G  
SC88  
(PbFree)  
3000 / Tape & Reel  
3000 / Tape & Reel  
Parameter  
Symbol  
Value  
500  
Unit  
JunctiontoAmbient – Steady State  
JunctiontoAmbient – t 5 s  
R
°C/W  
NTJD5121NT2G  
SC88  
(PbFree)  
q
JA  
R
470  
q
JA  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
1. Surface mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [2 oz] including traces).  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
October, 2013 Rev. 6  
NTJD5121N/D  

NTJD5121NT2G 替代型号

型号 品牌 替代类型 描述 数据表
NTJD5121NT1G ONSEMI

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Power MOSFET 60 V, 295 mA, Dual N-Channel with ESD Protection, SC-88

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