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NTJD4158CT1G PDF预览

NTJD4158CT1G

更新时间: 2024-11-01 10:30:19
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 143K
描述
Small Signal MOSFET 30 V/−20 V, +0.25/−0.88 A, Complementary, SC−88

NTJD4158CT1G 数据手册

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NTJD4158C  
Small Signal MOSFET  
30 V/20 V, +0.25/0.88 A,  
Complementary, SC88  
Features  
http://onsemi.com  
Leading 20 V Trench for Low R  
ESD Protected Gate  
SC88 Package for Small Footprint (2 x 2 mm)  
This is a PbFree Device  
Performance  
DS(on)  
V
R
Typ  
I Max  
D
(BR)DSS  
DS(on)  
1.0 W @ 4.5 V  
1.5 W @ 2.5 V  
NCh  
30 V  
0.25 A  
Applications  
215 mW @ 4.5 V  
345 mW @ 2.5 V  
PCh  
20 V  
0.88 A  
DCDC Conversion  
Load/Power Management  
Load Switch  
SC88 (SOT363)  
(6Leads)  
Cell Phones, MP3s, Digital Cameras, PDAs  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
S
G
D
1
2
3
6
5
4
D
1
1
1
2
Parameter  
DraintoSource Voltage  
Symbol Value  
Unit  
V
DSS  
V
NCh  
PCh  
NCh  
PCh  
30  
20  
20  
G
2
GatetoSource Voltage  
V
GS  
V
A
12  
S
2
NChannel  
Continuous Drain  
Current (Note 1)  
I
D
T = 25°C  
0.25  
A
Steady  
State  
T = 85°C  
A
0.18  
0.88  
0.63  
0.27  
(Top View)  
PChannel  
Continuous Drain  
Current (Note 1)  
T = 25°C  
A
MARKING DIAGRAM &  
PIN ASSIGNMENT  
Steady  
State  
T = 85°C  
A
Power Dissipation  
(Note 1)  
Steady  
State  
P
D
W
A
D1 G2 S2  
6
T = 25°C  
A
1
Pulsed Drain Cur-  
rent  
I
DM  
NCh  
PCh  
0.5  
TCD M G  
tp = 10 ms  
SC88 (SOT363)  
CASE 419B  
G
3.0  
Operating Junction and Storage Temperature  
T , T  
55 to  
150  
°C  
STYLE 26  
J
stg  
1
S1 G1 D2  
Source Current (Body Diode)  
I
A
NCh  
PCh  
0.25  
0.48  
260  
S
TCD  
M
G
= Specific Device Code  
= Date Code  
= PbFree Package  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
°C  
L
(Note: Microdot may be in either location)  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Max  
Unit  
ORDERING INFORMATION  
JunctiontoAmbient – Steady State (Note 1)  
R
460  
°C/W  
q
JA  
Device  
Package  
Shipping†  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 in sq pad size  
NTJD4158CT1G  
SC88  
(PbFree)  
3000 Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
(Cu area = 1.127 in sq [1 oz] including traces).  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
March, 2009 Rev. 2  
NTJD4158C/D  
 

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