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NTJD4401N

更新时间： 2024-09-15 03:45:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 66K
描述
Small Signal MOSFET 20 V, Dual N-Channel, SC-88 ESD Protection

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NTJD4401N 数据手册

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NTJD4401N  
Small Signal MOSFET  
20 V, Dual N−Channel, SC−88  
ESD Protection  
Features  
http://onsemi.com  
• Small Footprint (2 x 2 mm)  
• Low Gate Charge N−Channel Device  
• ESD Protected Gate  
• Same Package as SC−70 (6 Leads)  
• Pb−Free Packages are Available  
V
R
Typ  
I Max  
D
(BR)DSS  
DS(on)  
0.22 W @ 4.5 V  
0.32 W @ 2.5 V  
8 V  
0.775 A  
0.51 W @ 1.8 V  
Applications  
• Load Power switching  
SC−88 (SOT−363)  
• Li−Ion Battery Supplied Devices  
• Cell Phones, Media Players, Digital Cameras, PDAs  
• DC−DC Conversion  
S
G
D
1
6
5
4
D
1
1
1
2
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
2
3
G
2
Parameter  
Drain−to−Source Voltage  
Symbol  
Value Units  
V
DSS  
20  
V
V
A
S
2
Gate−to−Source Voltage  
V
GS  
12  
Continuous Drain  
Current  
Steady T = 25°C  
I
D
0.63  
0.46  
0.27  
0.14  
0.91  
0.65  
0.55  
0.29  
1.2  
A
State  
Top View  
T = 85°C  
A
(Based on R  
)
q
JA  
Power Dissipation  
(Based on R  
Steady T = 25°C  
P
D
W
A
A
)
State  
q
JA  
T = 85°C  
A
MARKING DIAGRAM &  
PIN ASSIGNMENT  
D1 G2 S2  
Continuous Drain  
Current  
Steady T = 25°C  
I
D
A
State  
T = 85°C  
A
(Based on R  
)
q
JL  
6
1
Power Dissipation  
(Based on R  
Steady T = 25°C  
W
A
)
State  
q
JL  
P
D
TD M G  
SC−88/SOT−363  
CASE 419B  
STYLE 28  
T = 85°C  
A
G
Pulsed Drain Current  
t ≤10 ms  
I
A
DM  
1
Operating Junction and Storage Temperature  
T , T  
−55 to  
150  
°C  
J
STG  
S1 G1 D2  
Continuous Source Current (Body Diode)  
I
0.63  
260  
A
TD  
M
G
= Device Code  
= Date Code  
= Pb−Free Package  
S
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
°C  
T
L
(Note: Microdot may be in either location)  
THERMAL RESISTANCE RATINGS (Note 1)  
Parameter  
Symbol Typ  
Max Units  
460 °C/W  
226  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
Junction−to−Ambient – Steady State  
Junction−to−Lead (Drain) – Steady State  
R
400  
194  
q
JA  
R
q
JL  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 oz Cu area = 0.9523 in sq.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
November, 2006 − Rev. 3  
NTJD4401N/D  
12345

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