NTJD4158C
Small Signal MOSFET
30 V/−20 V, +0.25/−0.88 A,
Complementary, SC−88
Features
http://onsemi.com
• Leading 20 V Trench for Low R
• ESD Protected Gate
• SC−88 Package for Small Footprint (2 x 2 mm)
• This is a Pb−Free Device
Performance
DS(on)
V
R
Typ
I Max
D
(BR)DSS
DS(on)
1.0 W @ 4.5 V
1.5 W @ 2.5 V
N−Ch
30 V
0.25 A
Applications
215 mW @ −4.5 V
345 mW @ −2.5 V
P−Ch
−20 V
−0.88 A
• DC−DC Conversion
• Load/Power Management
• Load Switch
SC−88 (SOT−363)
(6−Leads)
• Cell Phones, MP3s, Digital Cameras, PDAs
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
S
G
D
1
2
3
6
5
4
D
1
1
1
2
Parameter
Drain−to−Source Voltage
Symbol Value
Unit
V
DSS
V
N−Ch
P−Ch
N−Ch
P−Ch
30
−20
20
G
2
Gate−to−Source Voltage
V
GS
V
A
12
S
2
N−Channel
Continuous Drain
Current (Note 1)
I
D
T = 25°C
0.25
A
Steady
State
T = 85°C
A
0.18
−0.88
−0.63
0.27
(Top View)
P−Channel
Continuous Drain
Current (Note 1)
T = 25°C
A
MARKING DIAGRAM &
PIN ASSIGNMENT
Steady
State
T = 85°C
A
Power Dissipation
(Note 1)
Steady
State
P
D
W
A
D1 G2 S2
6
T = 25°C
A
1
Pulsed Drain Cur-
rent
I
DM
N−Ch
P−Ch
0.5
TCD M G
tp = 10 ms
SC−88 (SOT−363)
CASE 419B
G
−3.0
Operating Junction and Storage Temperature
T , T
−55 to
150
°C
STYLE 26
J
stg
1
S1 G1 D2
Source Current (Body Diode)
I
A
N−Ch
P−Ch
0.25
−0.48
260
S
TCD
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
°C
L
(Note: Microdot may be in either location)
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max
Unit
ORDERING INFORMATION
Junction−to−Ambient – Steady State (Note 1)
R
460
°C/W
q
JA
Device
Package
Shipping†
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
NTJD4158CT1G
SC−88
(Pb−Free)
3000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
(Cu area = 1.127 in sq [1 oz] including traces).
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
March, 2009 − Rev. 2
NTJD4158C/D