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IXTH50N30 PDF预览

IXTH50N30

更新时间: 2024-09-27 12:02:23
品牌 Logo 应用领域
IXYS 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
4页 587K
描述
Advance Technical Information High Current Power MOSFET

IXTH50N30 技术参数

是否无铅: 不含铅生命周期:Transferred
零件包装代码:TO-247AD包装说明:IN-LINE, R-PSIP-T3
针数:3Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.74
Is Samacsys:N雪崩能效等级(Eas):1500 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:300 V最大漏极电流 (ID):50 A
最大漏源导通电阻:0.065 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-247ADJESD-30 代码:R-PSIP-T3
JESD-609代码:e1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):200 A认证状态:Not Qualified
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXTH50N30 数据手册

 浏览型号IXTH50N30的Datasheet PDF文件第2页浏览型号IXTH50N30的Datasheet PDF文件第3页浏览型号IXTH50N30的Datasheet PDF文件第4页 
Advance Technical Information  
IXTH 50N30  
IXTT 50N30  
VDSS  
ID25  
= 300 V  
= 50 A  
High Current  
Power MOSFET  
RDS(on) = 65 mΩ  
N-Channel Enhancement Mode  
TO-247 (IXTH)  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
T
= 25°C to 150°C  
300  
300  
V
V
TJJ = 25°C to 150°C; RGS = 1 MΩ  
VGS  
VGSM  
Continuous  
Transient  
20  
30  
V
V
(TAB)  
ID25  
TC = 25°C  
50  
A
IDM  
IAR  
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
200  
50  
A
A
TO-268 (IXTT)  
EAR  
EAS  
TC = 25°C  
TC = 25°C  
50  
mJ  
J
1.5  
G
S
D (TAB)  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
,
5
V/ns  
PD  
TC = 25°C  
400  
W
G = Gate  
S = Source  
D = Drain  
TAB = Drain  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
TL  
1.6 mm (0.062 in.) from case for 10 s  
Mounting torque (TO-247)  
300  
°C  
Features  
Md  
1.13/10 Nm/lb.in.  
z
International standard packages  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
Unclamped Inductive Switching (UIS)  
rated  
Weight  
TO-247  
TO-268  
6
5
g
g
z
z
z
z
Low package inductance  
- easy to drive and to protect  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Min. Typ.  
Max.  
Advantages  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
VDS = VGS, ID = 250µA  
VGS = 20 VDC, VDS = 0  
VDS = VDSS  
300  
V
V
z
Easy to mount  
Space savings  
2.0  
4.0  
z
100  
nA  
z
High power density  
IDSS  
TJ = 25°C  
TJ = 125°C  
25  
250  
µA  
µA  
V
GS = 0 V  
VGS = 10 V, ID = 0.5 ID25  
Pulse test, t 300 µs, duty cycle d 2 %  
RDS(on)  
65 mΩ  
DS99011A(08/03)  
© 2003 IXYS All rights reserved  

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