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IXFN34N80 PDF预览

IXFN34N80

更新时间: 2024-11-04 22:11:55
品牌 Logo 应用领域
IXYS 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
4页 132K
描述
HiPerFETTM Power MOSFETs Single DieMOSFET

IXFN34N80 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:FLANGE MOUNT, R-XUFM-X4
针数:4Reach Compliance Code:compliant
风险等级:5.81Is Samacsys:N
其他特性:AVALANCHE RATED, UL RECOGNIZED雪崩能效等级(Eas):3000 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:800 V最大漏极电流 (Abs) (ID):34 A
最大漏极电流 (ID):34 A最大漏源导通电阻:0.24 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XUFM-X4
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):600 W
最大脉冲漏极电流 (IDM):136 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Nickel (Ni)端子形式:UNSPECIFIED
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXFN34N80 数据手册

 浏览型号IXFN34N80的Datasheet PDF文件第2页浏览型号IXFN34N80的Datasheet PDF文件第3页浏览型号IXFN34N80的Datasheet PDF文件第4页 
HiPerFETTM Power MOSFETs  
Single DieMOSFET  
IXFN 34N80  
VDSS = 800 V  
ID25 = 34 A  
RDS(on) = 0.24 W  
N-Channel Enhancement Mode  
Avalanche Rated, High dv/dt, Low trr  
D
trr £ 250 ns  
Preliminary data sheet  
S
Symbol Test Conditions  
MaximumRatings  
miniBLOC, SOT-227 B  
E153432  
VDSS  
VDGR  
TJ = 25°C to 150°C  
800  
800  
V
V
S
TJ = 25°C to 150°C; RGS = 1 MW  
G
VGS  
VGSM  
Continuous  
Transient  
±20  
±30  
V
V
S
ID25  
IDM  
IAR  
TC = 25°C  
TC = 25°C, pulse width limited by TJM  
34  
136  
34  
A
A
A
D
G = Gate  
S = Source  
D = Drain  
EAR  
EAS  
TC = 25°C  
TC = 25°C  
64  
3
mJ  
J
Either Source terminal of miniBLOC can be used  
as Main or Kelvin Source  
dv/dt  
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS  
TJ £ 150°C, RG = 2 W  
,
5
V/ns  
PD  
TC = 25°C  
600  
W
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
TJM  
Tstg  
Features  
-55 ... +150  
· Internationalstandardpackages  
· miniBLOC,withAluminiumnitride  
isolation  
TL  
1.6 mm (0.063 in) from case for 10 s  
300  
°C  
VISOL  
50/60 Hz, RMS  
IISOL£ 1 mA  
t = 1 min  
t = 1 s  
2500  
3000  
V~  
V~  
· Low RDS (on) HDMOSTM process  
· Rugged polysilicon gate cell structure  
· UnclampedInductiveSwitching(UIS)  
rated  
Md  
Mountingtorque  
Terminalconnectiontorque  
1.5/13 Nm/lb.in.  
1.5/13 Nm/lb.in.  
· Low package inductance  
· Fast intrinsic Rectifier  
Weight  
30  
g
Symbol  
TestConditions  
CharacteristicValues  
Applications  
(TJ = 25°C, unless otherwise specified)  
· DC-DC converters  
· Battery chargers  
min.  
typ.  
max.  
VDSS  
VGS = 0 V, ID = 3 mA  
800  
V
· Switched-modeandresonant-mode  
powersupplies  
· DC choppers  
VDSS temperature coefficient  
0.096  
%/K  
VGS(th)  
VDS = VGS, ID = 8 mA  
3.0  
5.0  
V
· Temperatureandlightingcontrols  
VGS(th) temperature coefficient  
-0.214  
%/K  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±200  
nA  
Advantages  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
100  
2
mA  
mA  
· Easy to mount  
· Space savings  
· High power density  
RDS(on)  
VGS = 10 V, ID = 0.5 • ID25  
Pulse test, t £ 300 ms,  
duty cycle d £ 2 %  
0.24  
W
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
98529D(6/99)  
1 - 4  

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