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IRFP250PBF

更新时间: 2024-02-19 08:14:40
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
8页 1864K
描述
Power MOSFET

IRFP250PBF 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:,Reach Compliance Code:unknown
风险等级:5.91配置:Single
最大漏极电流 (Abs) (ID):33 AFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-609代码:e0工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):180 W子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)

IRFP250PBF 数据手册

 浏览型号IRFP250PBF的Datasheet PDF文件第2页浏览型号IRFP250PBF的Datasheet PDF文件第3页浏览型号IRFP250PBF的Datasheet PDF文件第4页浏览型号IRFP250PBF的Datasheet PDF文件第5页浏览型号IRFP250PBF的Datasheet PDF文件第6页浏览型号IRFP250PBF的Datasheet PDF文件第7页 
IRFP250, SiHFP250  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
• Repetitive Avalanche Rated  
• Isolated Central Mounting Hole  
• Fast Switching  
• Ease of Paralleling  
• Simple Drive Requirements  
• Lead (Pb)-free Available  
PRODUCT SUMMARY  
VDS (V)  
200  
Available  
R
DS(on) (Ω)  
VGS = 10 V  
0.085  
RoHS*  
Qg (Max.) (nC)  
140  
28  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
74  
Configuration  
Single  
D
DESCRIPTION  
TO-247  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effictiveness.  
G
The TO-220 package is universially preferred for  
commercial-industrial applications where higher power  
levels preclude the use of TO-220 devices. The TO-247 is  
similar but superior to the earlier TO-218 package because  
of its isolated mounting hole. It also provides greater  
creepage distance between pins to meet the requirements of  
most safety specifications.  
S
S
N-Channel MOSFET  
D
G
ORDERING INFORMATION  
Package  
TO-247  
IRFP250PbF  
SiHFP250-E3  
IRFP250  
Lead (Pb)-free  
SnPb  
SiHFP250  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
VDS  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
200  
V
VGS  
20  
T
C = 25 °C  
30  
19  
Continuous Drain Current  
VGS at 10 V  
ID  
A
TC =100°C  
Pulsed Drain Currenta  
IDM  
120  
W/°C  
mJ  
A
Linear Derating Factor  
1.5  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
410  
30  
mJ  
W
EAR  
19  
Maximum Power Dissipation  
T
C = 25 °C  
PD  
190  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
5.0  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
300d  
10  
°C  
for 10 s  
6-32 or M3 screw  
lbf · in  
N · m  
Mounting Torque  
1.1  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 683 µH, RG = 25 Ω, IAS = 30 A (see fig. 12).  
c. ISD 30 A, dI/dt 190 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91212  
S-81274-Rev. A, 16-Jun-08  
www.vishay.com  
1

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