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IRFP254A PDF预览

IRFP254A

更新时间: 2024-09-28 04:23:19
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
7页 247K
描述
$GYDQFHG 3RZHU 026)(7

IRFP254A 数据手册

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IRFP254A  
FEATURES  
BVDSS = 250 V  
RDS(on) = 0.14  
ID = 25 A  
Avalanche Rugged Technology  
Rugged Gate Oxide Technology  
Lower Input Capacitance  
Improved Gate Charge  
Extended Safe Operating Area  
TO-3P  
Lower Leakage Current: 10 A (Max.) @ VDS = 250V  
µ
Low RDS(ON): 0.108 (Typ.)  
1
2
3
1.Gate 2. Drain 3. Source  
Absolute Maximum Ratings  
Symbol  
Characteristic  
Value  
250  
25  
Units  
VDSS  
Drain-to-Source Voltage  
V
Continuous Drain Current (TC=25°C)  
Continuous Drain Current (TC=100°C)  
Drain Current-Pulsed  
ID  
A
15.9  
100  
IDM  
VGS  
EAS  
IAR  
(1)  
A
V
Gate-to-Source Voltage  
30  
±
(2)  
(1)  
(1)  
(2)  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
781  
25  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Total Power Dissipation (TC=25°C)  
Linear Derating Factor  
mJ  
V/ns  
W
22.1  
4.8  
221  
1.79  
PD  
TJ , TSTG  
TL  
W/°C  
Operating Junction and  
- 55 to +150  
300  
Storage Temperature Range  
Maximum Lead Temp. for Soldering  
°C  
Purposes, 1/8 from case for 5-seconds  
Thermal Resistance  
Symbol  
RθJC  
Characteristic  
Junction-to-Case  
Case-to-Sink  
Typ.  
Max.  
Units  
--  
0.24  
--  
0.56  
--  
RθCS  
°C/W  
RθJA  
Junction-to-Ambient  
40  
Rev. B  
©1999 Fairchild Semiconductor Corporation  

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