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IRFP250NPBF PDF预览

IRFP250NPBF

更新时间: 2024-11-02 04:23:19
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲PC局域网
页数 文件大小 规格书
9页 205K
描述
HEXFET㈢ Power MOSFET

IRFP250NPBF 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:15 weeks
风险等级:0.63Samacsys Confidence:4
Samacsys Status:ReleasedSamacsys PartID:378584
Samacsys Pin Count:3Samacsys Part Category:MOSFET (N-Channel)
Samacsys Package Category:Transistor Outline, VerticalSamacsys Footprint Name:TO-247AC
Samacsys Released Date:2017-04-30 06:08:57Is Samacsys:N
其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE雪崩能效等级(Eas):315 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:200 V最大漏极电流 (Abs) (ID):30 A
最大漏极电流 (ID):30 A最大漏源导通电阻:0.075 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247AC
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):250极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):214 W最大脉冲漏极电流 (IDM):120 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRFP250NPBF 数据手册

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PD - 95007  
IRFP250NPbF  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
D
VDSS = 200V  
l Fully Avalanche Rated  
l Ease of Paralleling  
RDS(on) = 0.075Ω  
G
l Simple Drive Requirements  
l Lead-Free  
ID = 30A  
S
Description  
FifthGenerationHEXFETsfromInternationalRectifierutilizeadvancedprocessing  
techniques to achieve extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized device design that  
HEXFET Power MOSFETs are well known for, provides the designer with an  
extremely efficient and reliable device for use in a wide variety of applications.  
The TO-247 package is preferred for commercial-industrial applications where  
higher power levels preclude the use of TO-220 devices. The TO-247 is similar  
but superior tothe earlier TO-218 package because ofits isolated mounting hole.  
TO-247AC  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
30  
21  
A
120  
PD @TC = 25°C  
Power Dissipation  
214  
W
W/°C  
V
Linear Derating Factor  
1.4  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
315  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
30  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
21  
mJ  
V/ns  
8.6  
-55 to +175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 srew  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
Units  
RθJC  
RθCS  
RθJA  
0.7  
–––  
40  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.24  
–––  
°C/W  
www.irf.com  
1
2/11/04  

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