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IRFP250N PDF预览

IRFP250N

更新时间: 2024-01-29 07:22:50
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关局域网
页数 文件大小 规格书
8页 122K
描述
Power MOSFET(Vdss = 200 V, Rds(on)=0.075ohm, Id=30A)

IRFP250N 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:,Reach Compliance Code:unknown
风险等级:5.91配置:Single
最大漏极电流 (Abs) (ID):33 AFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-609代码:e0工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):180 W子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Lead (Sn/Pb)

IRFP250N 数据手册

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PD - 94008  
IRFP250N  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
l Fully Avalanche Rated  
l Ease of Paralleling  
D
VDSS = 200V  
R
DS(on) = 0.075Ω  
G
ID = 30A  
S
l Simple Drive Requirements  
Description  
FifthGenerationHEXFETsfromInternationalRectifierutilizeadvancedprocessing  
techniques to achieve extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized device design that  
HEXFET Power MOSFETs are well known for, provides the designer with an  
extremely efficient and reliable device for use in a wide variety of applications.  
The TO-247 package is preferred for commercial-industrial applications where  
higher power levels preclude the use of TO-220 devices. The TO-247 is similar  
but superior to the earlier TO-218 package because of its isolated mounting hole.  
TO-247AC  
Absolute Maximum Ratings  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
Max.  
30  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
21  
A
120  
214  
1.4  
± 20  
315  
30  
PD @TC = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
21  
mJ  
V/ns  
8.6  
-55 to +175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 srew  
°C  
300 (1.6mm from case )  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
Units  
RθJC  
RθCS  
RθJA  
0.7  
–––  
40  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.24  
–––  
°C/W  
www.irf.com  
1
10/09/00  

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