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FDMC86106LZ PDF预览

FDMC86106LZ

更新时间: 2024-11-21 12:03:11
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 323K
描述
N-Channel Power Trench® MOSFET 100 V, 7.5 A, 103 mΩ

FDMC86106LZ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, S-PDSO-N5
针数:8Reach Compliance Code:compliant
风险等级:1.69其他特性:LOGIC LEVEL COMPATIBLE
雪崩能效等级(Eas):12 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):9.6 A最大漏极电流 (ID):3.3 A
最大漏源导通电阻:0.103 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-PDSO-N5JESD-609代码:e4
湿度敏感等级:1元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):19 W最大脉冲漏极电流 (IDM):15 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDMC86106LZ 数据手册

 浏览型号FDMC86106LZ的Datasheet PDF文件第2页浏览型号FDMC86106LZ的Datasheet PDF文件第3页浏览型号FDMC86106LZ的Datasheet PDF文件第4页浏览型号FDMC86106LZ的Datasheet PDF文件第5页浏览型号FDMC86106LZ的Datasheet PDF文件第6页浏览型号FDMC86106LZ的Datasheet PDF文件第7页 
December 2010  
FDMC86106LZ  
N-Channel Power Trench® MOSFET  
100 V, 7.5 A, 103 mΩ  
Features  
General Description  
„ Max rDS(on) = 103 mΩ at VGS = 10 V, ID = 3.3 A  
„ Max rDS(on) = 153 mΩ at VGS = 4.5 V, ID = 2.7 A  
„ HBM ESD protection level > 3 KV typical (Note 4)  
„ 100% UIL Tested  
This N-Channel logic Level MOSFETs are produced using  
Fairchild Semiconductor‘s advanced Power Trench® process  
that has been special tailored to minimize the on-state  
resistance and yet maintain superior switching performance.  
G-S zener has been added to enhance ESD voltage level.  
„ RoHS Compliant  
Application  
„ DC - DC Conversion  
Bottom  
Top  
Pin 1  
5
6
4
3
G
S
S
S
D
D
D
G
S
S
S
7
8
2
1
D
D
D
D
D
MLP 3.3x3.3  
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
100  
V
V
±20  
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC = 25 °C  
C = 25 °C  
7.5  
T
9.6  
ID  
A
TA = 25 °C  
(Note 1a)  
(Note 3)  
3.3  
-Pulsed  
15  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
12  
19  
mJ  
W
TC = 25 °C  
TA = 25 °C  
PD  
Power Dissipation  
(Note 1a)  
2.3  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
6.5  
53  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13 ’’  
Tape Width  
12 mm  
Quantity  
FDMC86106Z  
FDMC86106LZ  
Power 33  
3000 units  
©2010 Fairchild Semiconductor Corporation  
FDMC86106LZ Rev.C  
www.fairchildsemi.com  
1

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