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FDMC86160 PDF预览

FDMC86160

更新时间: 2024-01-11 05:19:23
品牌 Logo 应用领域
安森美 - ONSEMI 开关脉冲光电二极管晶体管
页数 文件大小 规格书
7页 614K
描述
N 沟道,PowerTrench® MOSFET,100V,43A,14mΩ

FDMC86160 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:QFN
包装说明:SMALL OUTLINE, S-PDSO-N5针数:8
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:3.86
雪崩能效等级(Eas):181 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):43 A最大漏极电流 (ID):9 A
最大漏源导通电阻:0.014 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:MO-240BAJESD-30 代码:S-PDSO-N5
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):54 W最大脉冲漏极电流 (IDM):50 A
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDMC86160 数据手册

 浏览型号FDMC86160的Datasheet PDF文件第2页浏览型号FDMC86160的Datasheet PDF文件第3页浏览型号FDMC86160的Datasheet PDF文件第4页浏览型号FDMC86160的Datasheet PDF文件第5页浏览型号FDMC86160的Datasheet PDF文件第6页浏览型号FDMC86160的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
MOSFET – N-Channel,  
Shielded Gate,  
POWERTRENCH)  
V
r
MAX  
I MAX  
D
DS  
DS(on)  
100 V  
14 mW @ 10 V  
23 mW @ 6 V  
43 A  
100 V, 43 A, 14 mW  
Pin 1  
Pin 1  
S
S
S
G
FDMC86160  
D
D
D
D
General Description  
This NChannel MOSFET is produced using onsemi’s advanced  
PowerTrench process that incorporates Shielded Gate technology. This  
process has been optimized for the onstate resistance. This device is  
Top  
Bottom  
WDFN8 3.3X3.3, 0.65P  
CASE 483AW  
well suited for applications where ulta low R  
is required in small  
DS(on)  
spaces such as High performance VRM, POL and orring functions.  
MARKING DIAGRAM  
Applications  
Bridge Topologies  
Synchronous Rectifier  
XXXX  
AYWW  
Features  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
Shielded Gate MOSFET Technology  
Max r  
Max r  
= 14 mW at V = 10 V, I = 9 A  
GS D  
DS(on)  
WW = Work Week  
= 23 mW at V = 6 V, I = 7 A  
DS(on)  
GS  
D
High Performance Technology for Extremely Low r  
This Device is LeadFree and RoHS Compliant  
DS(on)  
PIN ASSIGNMENT  
ABSOLUTE MAXIMUM RATINGS T = 25°C unless otherwise noted  
A
S
8
D
1
2
Symbol  
Parameter  
DrainSource Voltage  
Value  
100  
20  
Unit  
V
S
S
7
6
5
D
D
D
V
DSS  
GSS  
GateSource Voltage  
V
V
3
4
Drain Current  
Continuous  
Continuous  
Pulsed  
I
D
(T = 25°C)  
A
43  
9
50  
A
C
G
(T = 25°C) (Note 1a)  
(Note 4)  
Single Pulse Avalanche Energy  
Power Dissipation  
(Note 3)  
181  
mJ  
W
E
AS  
P
D
ORDERING INFORMATION  
(T = 25°C)  
54  
2.3  
C
(T = 25°C) (Note 1a)  
A
Device  
Package  
Shipping  
Operating and Storage Junction  
STG  
_C  
55 to +150  
T , T  
J
Temperature Range  
FDMC86160  
WDFN8  
3000 /  
3.3X3.3, 0.65P  
CASE 483AW  
(PbFree)  
Tape & Reel  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifica-  
tions Brochure, BRD8011/D.  
THERMAL CHARACTERISTICS T = 25°C unless otherwise noted  
A
Symbol  
Parameter  
Value  
Unit  
Thermal Resistance, JunctiontoAmbient  
°C/W  
2.3  
R
θ
JC  
(Note 1)  
Thermal Resistance, JunctiontoCase  
°C/W  
53  
R
θ
JA  
(Note 1a)  
© Semiconductor Components Industries, LLC, 2023  
1
Publication Order Number:  
January, 2023 Rev. 3  
FDMC86160/D  

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