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CSD19505KCS

更新时间: 2024-11-28 12:49:43
品牌 Logo 应用领域
德州仪器 - TI 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
10页 820K
描述
CSD19505KCS, 80 V N-Channel NexFET Power MOSFETs

CSD19505KCS 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:ROHS COMPLIANT, PLASTIC PACKAGE-3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95Factory Lead Time:12 weeks
风险等级:1.68Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):510 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:80 V最大漏极电流 (ID):150 A
最大漏源导通电阻:0.0038 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):34 pFJEDEC-95代码:TO-220
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):400 A表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

CSD19505KCS 数据手册

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CSD19505KCS  
www.ti.com  
SLPS480 JANUARY 2014  
CSD19505KCS, 80 V N-Channel NexFET™ Power MOSFETs  
Check for Samples: CSD19505KCS  
1
FEATURES  
2
Ultra-Low Qg and Qgd  
PRODUCT SUMMARY  
Low Thermal Resistance  
Avalanche Rated  
TA = 25°C  
VDS  
TYPICAL VALUE  
UNIT  
V
Drain-to-Source Voltage  
Gate Charge Total (10 V)  
Gate Charge Gate to Drain  
80  
76  
11  
Qg  
nC  
nC  
m  
mΩ  
V
Pb-Free Terminal Plating  
RoHS Compliant  
Qgd  
VGS = 6 V  
VGS = 10 V  
2.6  
2.9  
2.6  
RDS(on) Drain-to-Source On Resistance  
VGS(th) Threshold Voltage  
Halogen Free  
TO-220 Plastic Package  
APPLICATIONS  
ORDERING INFORMATION  
Device  
CSD19505KCS  
Package  
Media  
Qty  
Ship  
Tube  
Secondary Side Synchronous Rectifier  
Motor Control  
TO-220 Plastic  
Package  
Tube  
50  
DESCRIPTION  
This 80 V, 2.6 mΩ, TO-220 NexFET™ power  
MOSFET is designed to minimize losses in power  
conversion applications.  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C  
VALUE  
UNIT  
VDS  
VGS  
Drain-to-Source Voltage  
80  
V
V
Gate-to-Source Voltage  
±20  
150  
Continuous Drain Current (Package limited)  
Pinout Drawing  
Continuous Drain Current (Silicon limited),  
TC = 25°C  
Drain (Pin 2)  
208  
147  
ID  
A
Continuous Drain Current (Silicon limited),  
TC = 100°C  
IDM  
PD  
TJ,  
Pulsed Drain Current (1)  
201  
300  
A
Power Dissipation  
W
Operating Junction and  
–55 to 175  
510  
°C  
Gate  
(Pin 1)  
TSTG Storage Temperature Range  
Avalanche Energy, single pulse  
EAS  
mJ  
ID = 101 A, L = 0.1 mH, RG = 25 Ω  
(1) Pulse duration 300 μs, Duty cycle 1%  
Source (Pin 3)  
RDS(on) vs VGS  
GATE CHARGE  
10  
10  
TC = 25°C,I D = 100A  
TC = 125°C,I D = 100A  
ID = 100A  
VDS = 40V  
9
9
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
0
10  
20  
30  
40  
50  
60  
70  
80  
Qg - Gate Charge (nC)  
VGS - Gate-to- Source Voltage (V)  
G001  
G001  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NexFET is a trademark of Texas Instruments.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2014, Texas Instruments Incorporated  
 

CSD19505KCS 替代型号

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