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CSD19535KTTT PDF预览

CSD19535KTTT

更新时间: 2024-11-29 02:58:39
品牌 Logo 应用领域
德州仪器 - TI 局域网开关脉冲晶体管
页数 文件大小 规格书
10页 804K
描述
100V N-Channel NexFET Power MOSFET

CSD19535KTTT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:TO-263, D2PAK-3/2
Reach Compliance Code:not_compliantFactory Lead Time:6 weeks
风险等级:1.67Samacsys Description:Texas Instruments CSD19535KTTT N-channel MOSFET Transistor, 200 A, 100 V, 3-Pin DDPAK, TO-263
其他特性:AVALANCHE RATED雪崩能效等级(Eas):451 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (ID):200 A
最大漏源导通电阻:0.0041 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):38 pFJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):400 A表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

CSD19535KTTT 数据手册

 浏览型号CSD19535KTTT的Datasheet PDF文件第2页浏览型号CSD19535KTTT的Datasheet PDF文件第3页浏览型号CSD19535KTTT的Datasheet PDF文件第4页浏览型号CSD19535KTTT的Datasheet PDF文件第5页浏览型号CSD19535KTTT的Datasheet PDF文件第6页浏览型号CSD19535KTTT的Datasheet PDF文件第7页 
CSD19535KCS  
www.ti.com  
SLPS484 JANUARY 2014  
CSD19535KCS, 100 V N-Channel NexFET™ Power MOSFET  
Check for Samples: CSD19535KCS  
1
FEATURES  
2
Ultra-Low Qg and Qgd  
PRODUCT SUMMARY  
Low Thermal Resistance  
Avalanche Rated  
TA = 25°C  
VDS  
TYPICAL VALUE  
UNIT  
V
Drain-to-Source Voltage  
Gate Charge Total (10 V)  
Gate Charge Gate to Drain  
100  
78  
Qg  
nC  
nC  
m  
mΩ  
V
Pb-Free Terminal Plating  
RoHS Compliant  
Qgd  
13  
VGS = 6 V  
VGS = 10 V  
2.7  
3.4  
3.1  
RDS(on) Drain-to-Source On Resistance  
VGS(th) Threshold Voltage  
Halogen Free  
TO-220 Plastic Package  
APPLICATIONS  
ORDERING INFORMATION  
Device  
CSD19535KCS  
Package  
Media  
Qty  
Ship  
Tube  
Secondary Side Synchronous Rectifier  
Motor Control  
TO-220 Plastic  
Package  
Tube  
50  
DESCRIPTION  
This 100 V, 3.1 mΩ, TO-220 NexFET™ power  
MOSFET is designed to minimize losses in power  
conversion applications.  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C  
VALUE  
UNIT  
VDS  
VGS  
Drain-to-Source Voltage  
100  
±20  
150  
V
V
Gate-to-Source Voltage  
Continuous Drain Current (Package limited)  
Pin Out Drawing  
Continuous Drain Current (Silicon limited),  
TC = 25°C  
Drain (Pin 2)  
187  
133  
ID  
A
Continuous Drain Current (Silicon limited),  
TC = 100°C  
IDM  
PD  
TJ,  
Pulsed Drain Current (1)  
181  
300  
A
Power Dissipation  
W
Operating Junction and Storage  
–55 to 175  
451  
°C  
Gate  
(Pin 1)  
TSTG Temperature Range  
Avalanche Energy, single pulse  
ID = 95 A, L = 0.1 mH, RG = 25 Ω  
EAS  
mJ  
(1) Pulse duration 300 μs, Duty cycle 1%  
Source (Pin 3)  
RDS(on) vs VGS  
GATE CHARGE  
10  
10  
TC = 25°C,I D = 100A  
TC = 125°C,I D = 100A  
ID = 100A  
VDS = 50V  
9
9
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
0
8
16  
24  
32  
40  
48  
56  
64  
72  
80  
Qg - Gate Charge (nC)  
VGS - Gate-to- Source Voltage (V)  
G001  
G001  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NexFET is a trademark of Texas Instruments.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2014, Texas Instruments Incorporated  
 

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TRANSISTOR | BJT | NPN | 700V V(BR)CEO | 2.5A I(C) | TO-3