Datasheet > 射频和微波 > 射频/微波耦合器> CSD-20H-1.9G

CSD-20H-1.9G

更新时间： 2024-09-21 06:49:31

品牌	Logo	应用领域
MERRIMAC		射频和微波射频耦合器微波耦合器分离技术隔离技术
页数	文件大小	规格书
5页	182K
描述
DIRECTIONAL COUPLERS

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CSD-20H-1.9G 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Transferred	Reach Compliance Code：	unknown
风险等级：	5.74	Is Samacsys：	N
其他特性：	HIGH ISOLATION	构造：	COMPONENT
最大输入功率 (CW)：	50 dBm	最大插入损耗：	0.25 dB
最大工作频率：	2000 MHz	最小工作频率：	1700 MHz
最高工作温度：	85 °C	最低工作温度：	-55 °C
射频/微波设备类型：	DIRECTIONAL COUPLER	最大电压驻波比：	1.2
Base Number Matches：	1

CSD-20H-1.9G 数据手册

CSD-20H-1.9G

DIRECTIONAL COUPLERS

REV: 003, 02/13/03

• 1.7 - 2.0 GHz

• LOWEST LOSS

• HIGHEST ISOLATION

• BEST PHASE/AMPLITUDE BALANCE

• SURFACE MOUNT

• TAPE & REEL

TECHNICAL DESCRIPTION / APPLICATION

MULTI-MIX DIRECTIONAL COUPLERS

The Multi-Mix^®CSD series provides directional couplers with low insertion loss, low VSWR, and high directivity.

Precise coupling and frequency sensitivity make them ideal for applications power amplifiers, signal

distribution and processing.

CSD directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process

yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance

that is superior to conventional adhesive bonding techniques.

The CSD series is an easy to install SMD designed specifically for the full spectrum of wireless applications.

The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common

substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM

shielding.

Additional benefits include:

AVAILABLE ON

TAPE & REEL

•

Available on tape and reel.

Cost effective for commercial wireless applications.

Industry standard size.

Temperature stable from –65 to +125 degrees C.

Can be integrated with other Multi-Mix^®components in a multi-function module.

RELIABILITY

All CSD series components are 100% tested. The product family has passed environmental screening per

MIL-STD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture

Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).

THE MULTI-MIX PROCESS

Multi-Mix^®is a manufacturing process based on fluoropolymer composite substrates that are fusion bonded

together into a multilayer structure. The fusion bonding process yields a homogeneous monolithic structure

with superior performance at microwave and millimeter wave frequencies. The bonded multilayers can

contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated-through vias to

form a SMD module that requires no additional packaging and is ready for pick and place.

THE MULTI-MIX MICROTECHNOLOGY GROUP IS ISO-9001 REGISTERED

Merrimac Industries, Inc. / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com

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与CSD-20H-1.9G相关器件

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CSD-20K-.75G	MERRIMAC	获取价格	Directional Coupler, 500MHz Min, 1000MHz Max, 0.4dB Insertion Loss-Max,
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CSD-20M-3G	MERRIMAC	获取价格	DIRECTIONAL COUPLER
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