Datasheet > CSD-20H-2.2G

CSD-20H-2.2G

更新时间： 2024-11-29 06:49:31

品牌	Logo	应用领域
MERRIMAC		/
页数	文件大小	规格书
5页	137K
描述
DIRECTIONAL COUPLER

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技术参数
数据手册

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CSD-20H-2.2G 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Transferred	Reach Compliance Code：	unknown
风险等级：	5.74	其他特性：	HIGH ISOLATION
构造：	COMPONENT	最大输入功率 (CW)：	50 dBm
最大插入损耗：	0.2 dB	最大工作频率：	2200 MHz
最小工作频率：	2100 MHz	最高工作温度：	85 °C
最低工作温度：	-55 °C	射频/微波设备类型：	DIRECTIONAL COUPLER
最大电压驻波比：	1.2	Base Number Matches：	1

CSD-20H-2.2G 数据手册

CSD-20H-2.2G

DIRECTIONAL COUPLER

REV: 001, 12/12/01

•

2.1 - 2.2 GHz

LOWEST LOSS

HIGHEST ISOLATION

BEST PHASE/AMPLITUDE BALANCE

SURFACE MOUNT

• TAPE & REEL

TECHNICAL DESCRIPTION / APPLICATION

MULTI-MIX^®DIRECTIONAL COUPLERS

The Multi-Mix^®CSD series provides directional couplers with low insertion loss, low VSWR, and high

directivity. Precise coupling and frequency sensitivity make them ideal for applications power ampli-

fiers, signal distribution and processing.

CSD directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process

yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical perform-

ance that is superior to conventional adhesive bonding techniques.

The CSD series is an easy to install SMD designed specifically for the full spectrum of wireless applica-

tions. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with

common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides

excellent EM shielding.

Additional benefits include:

• Available on tape and reel

AVAILABLE ON

TAPE & REEL

• Cost effective for commercial wireless applications

• Industry standard size

• Temperature stable from –65 to +125 degrees C.

• Can be integrated with other Multi-Mix^®components in a multi-function module

RELIABILITY

All CSD series components are 100% tested. The product family has passed environmental screening

per MIL-STD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture

Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).

THE MULTI-MIX^®PROCESS

Multi-Mix^®is a manufacturing process based on fluoropolymer composite substrates that are fusion

bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-

lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded

multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plat-

ed-through vias to form a SMD module that requires no additional packaging and is ready for pick and

place.

THE MULTI-MIX MICROTECHNOLOGY^®GROUP IS ISO-9001 REGISTERED

Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com

12 3 4 5

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