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CSD-20H-0.9G PDF预览

CSD-20H-0.9G

更新时间: 2024-11-28 06:49:31
品牌 Logo 应用领域
MERRIMAC 射频和微波射频耦合器微波耦合器分离技术隔离技术
页数 文件大小 规格书
5页 149K
描述
DIRECTIONAL COUPLER

CSD-20H-0.9G 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:TransferredReach Compliance Code:unknown
风险等级:5.71Is Samacsys:N
其他特性:HIGH ISOLATION构造:COMPONENT
最大输入功率 (CW):51.76 dBm最大插入损耗:0.25 dB
最大工作频率:1000 MHz最小工作频率:800 MHz
最高工作温度:85 °C最低工作温度:-55 °C
射频/微波设备类型:DIRECTIONAL COUPLER最大电压驻波比:1.25
Base Number Matches:1

CSD-20H-0.9G 数据手册

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CSD-20H-0.9G  
DIRECTIONAL COUPLER  
REV: 002, 02/13/03  
0.8 - 1.0 GHz  
LOWEST LOSS  
HIGHEST ISOLATION  
BEST PHASE/AMPLITUDE BALANCE  
SURFACE MOUNT  
• TAPE & REEL  
TECHNICAL DESCRIPTION / APPLICATION  
MULTI-MIX® DIRECTIONAL COUPLERS  
The Multi-Mix® CSD series provides directional couplers with low insertion loss, low VSWR, and high  
directivity. Precise coupling and frequency sensitivity make them ideal for applications power ampli-  
fiers, signal distribution and processing.  
CSD directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process  
yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical perform-  
ance that is superior to conventional adhesive bonding techniques.  
The CSD series is an easy to install SMD designed specifically for the full spectrum of wireless applica-  
tions. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with  
common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides  
excellent EM shielding.  
Additional benefits include:  
• Available on tape and reel  
AVAILABLE ON  
TAPE & REEL  
• Cost effective for commercial wireless applications  
• Industry standard size  
Temperature stable from –65 to +125 degrees C.  
• Can be integrated with other Multi-Mix® components in a multi-function module  
RELIABILITY  
All CSD series components are 100% tested. The product family has passed environmental screening  
per MIL-STD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture  
Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).  
THE MULTI-MIX® PROCESS  
Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion  
bonded together into a multilayer structure. The fusion bonding process yields a homogeneous mono-  
lithic structure with superior performance at microwave and millimeter wave frequencies. The bonded  
multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plat-  
ed-through vias to form a SMD module that requires no additional packaging and is ready for pick and  
place.  
THE MULTI-MIX MICROTECHNOLOGY® GROUP IS ISO-9001 REGISTERED  
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006  
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com  

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