Datasheet > CSD-20Z-1.9G

CSD-20Z-1.9G

更新时间： 2024-11-28 09:33:51

品牌	Logo	应用领域
MERRIMAC		/
页数	文件大小	规格书
5页	123K
描述
DIRECTIONAL COUPLERS

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技术参数
数据手册

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CSD-20Z-1.9G 技术参数

生命周期：	Transferred	Reach Compliance Code：	unknown
风险等级：	5.74	构造：	COMPONENT
最大输入功率 (CW)：	50 dBm	最大插入损耗：	0.2 dB
最大工作频率：	2000 MHz	最小工作频率：	1700 MHz
最高工作温度：	85 °C	最低工作温度：	-55 °C
射频/微波设备类型：	DIRECTIONAL COUPLER	最大电压驻波比：	1.3
Base Number Matches：	1

CSD-20Z-1.9G 数据手册

CSD-20Z-1.9G

DIRECTIONAL COUPLERS

REV: 017, 03/27/02

• 1.7 - 2.0 GHz

• HIGH POWER…100 WATTS CW

• LOW LOSS

• LOW VSWR

• SURFACE MOUNT

• TAPE & REEL

TECHNICAL DESCRIPTION / APPLICATION

MULTI-MIX PICO™ Z-SERIES DIRECTIONAL COUPLERS

The Multi-Mix^®CSD-Z series provides directional couplers with low insertion loss, low VSWR, and high

power handling in a small outline. Precise coupling and frequency sensitivity make them ideal for

applications involving power amplifiers, signal distribution and processing.

CSD-Z directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding

process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical

performance that is superior to conventional adhesive bonding techniques.

The CSD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless

applications. The high stability ceramic filled PTFE dielectrics utilized in these components are

compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground

plane provides excellent EM shielding.

Additional benefits include:

• Small outline size

AVAILABLE ON

TAPE & REEL

• High power…100 Watts CW

• Cost effective for commercial wireless applications

• Operating temperature range –55°C to +85°C.

• Available on tape and reel

• Can be integrated with other Multi-Mix^®components in a multi-function module

RELIABILITY

The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration,

Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life

Test (>1000 cycles).

THE MULTI-MIX^®PROCESS

Multi-Mix^®is a manufacturing process based on fluoropolymer composite substrates that are fusion

bonded together into a multilayer structure. The fusion bonding process yields a homogeneous

monolithic structure with superior performance at microwave and millimeter wave frequencies. The

bonded multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns,

and plated-through vias to form a SMD module that requires no additional packaging and is suitable for

automated assembly.

THE MULTI-MIX MICROTECHNOLOGY^®GROUP IS ISO-9001 REGISTERED

Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006

Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com

12 3 4 5

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与CSD-20Z-1.9G相关器件

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CSD-20Z-5.5G	MERRIMAC	获取价格	DIRECTIONAL COUPLER
CSD22202W15	TI	获取价格	P-Channel NexFET Power MOSFET
CSD22204W	TI	获取价格	采用 1.5mm x 1.5mm WLP 封装、具有栅极 ESD 保护的单路、9.9mΩ、
CSD22204WT	TI	获取价格	采用 1.5mm x 1.5mm WLP 封装、具有栅极 ESD 保护的单路、9.9mΩ、
CSD22205L	TI	获取价格	采用 1.2mm x 1.2mm LGA 封装、具有栅极 ESD 保护的单路、9.9mΩ、
CSD22205LT	TI	获取价格	采用 1.2mm x 1.2mm LGA 封装、具有栅极 ESD 保护的单路、9.9mΩ、
CSD22206W	TI	获取价格	采用 1.5mm x 1.5mm WLP 封装、具有栅极 ESD 保护的单路、5.7mΩ、

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