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CSD19506KTT

更新时间: 2024-11-28 13:01:51
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德州仪器 - TI 晶体晶体管功率场效应晶体管开关脉冲PC局域网
页数 文件大小 规格书
10页 476K
描述
80V, N ch NexFET MOSFET™, single D2PAK, 2.3mOhm 3-DDPAK/TO-263 -55 to 175

CSD19506KTT 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active包装说明:D2PAK-3
Reach Compliance Code:not_compliantECCN代码:EAR99
Factory Lead Time:6 weeks风险等级:1.66
Samacsys Confidence:4Samacsys Status:Released
Samacsys PartID:656061Samacsys Pin Count:3
Samacsys Part Category:MOSFET (N-Channel)Samacsys Package Category:Other
Samacsys Footprint Name:KTT-(R-PSFM-G3)Samacsys Released Date:2019-09-13 15:56:14
Is Samacsys:N其他特性:AVALANCHE RATED
雪崩能效等级(Eas):832 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:80 V
最大漏极电流 (ID):200 A最大漏源导通电阻:0.0028 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):55 pF
JESD-30 代码:R-PSSO-G3JESD-609代码:e3
湿度敏感等级:2元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):400 A
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

CSD19506KTT 数据手册

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CSD19506KCS  
www.ti.com  
SLPS481 DECEMBER 2013  
80V N-Channel NexFET™ Power MOSFETs  
Check for Samples: CSD19506KCS  
1
FEATURES  
2
Ultra-Low Qg and Qgd  
Low Thermal Resistance  
Avalanche Rated  
PRODUCT SUMMARY  
TA = 25°C  
VDS  
TYPICAL VALUE  
UNIT  
V
Drain-to-Source Voltage  
Gate Charge Total (10 V)  
Gate Charge Gate to Drain  
80  
120  
20  
Qg  
nC  
nC  
m  
mΩ  
V
Pb-Free Terminal Plating  
RoHS Compliant  
Qgd  
VGS = 6 V  
2.2  
2.0  
RDS(on) Drain-to-Source On Resistance  
VGS(th) Threshold Voltage  
Halogen Free  
VGS = 10 V  
TO-220 Plastic Package  
2.5  
APPLICATIONS  
ORDERING INFORMATION  
Device  
CSD19506KCS  
Package  
Media  
Qty  
Ship  
Tube  
Secondary Side Synchronous Rectifier  
Motor Control  
TO-220 Plastic  
Package  
Tube  
50  
DESCRIPTION  
This 80 V, 2.0 mΩ, TO-220 NexFET™ power  
MOSFET is designed to minimize losses in power  
conversion applications.  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C  
VALUE  
UNIT  
VDS  
VGS  
Drain-to-Source Voltage  
80  
V
V
Gate-to-Source Voltage  
±20  
100  
Continuous Drain Current (Package limited)  
Pin Out Drawing  
Continuous Drain Current (Silicon limited),  
TC = 25°C  
Drain (Pin 2)  
273  
193  
ID  
A
Continuous Drain Current (Silicon limited),  
TC = 100°C  
IDM  
PD  
TJ,  
Pulsed Drain Current (1)  
236  
375  
A
Power Dissipation  
W
Operating Junction and Storage  
–55 to 175  
832  
°C  
Gate  
(Pin 1)  
TSTG Temperature Range  
Avalanche Energy, single pulse  
ID = 129 A, L = 0.1 mH, RG = 25 Ω  
EAS  
mJ  
(1) Pulse duration 300 μs, Duty cycle 1%  
Source (Pin 3)  
RDS(on) vs VGS  
GATE CHARGE  
10  
10  
TC = 25°C,I D = 100A  
TC = 125°C,I D = 100A  
ID = 100A  
VDS = 40V  
9
9
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
0
2
4
6
8
10  
12  
14  
16  
18  
20  
0
20  
40  
60  
80  
100  
120  
140  
Qg - Gate Charge (nC)  
VGS - Gate-to- Source Voltage (V)  
G001  
G001  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NexFET is a trademark of Texas Instruments.  
2
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  
 

CSD19506KTT 替代型号

型号 品牌 替代类型 描述 数据表
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