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AUIRF7103Q PDF预览

AUIRF7103Q

更新时间: 2024-09-17 12:42:11
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
13页 230K
描述
Advanced Planar Technology Dual N Channel MOSFET

AUIRF7103Q 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G8Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.17
Is Samacsys:N其他特性:HIGH RELIABILITY
雪崩能效等级(Eas):22 mJ配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:50 V最大漏极电流 (ID):3 A
最大漏源导通电阻:0.13 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:MS-012AAJESD-30 代码:R-PDSO-G8
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:8
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):25 A认证状态:Not Qualified
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:40晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

AUIRF7103Q 数据手册

 浏览型号AUIRF7103Q的Datasheet PDF文件第2页浏览型号AUIRF7103Q的Datasheet PDF文件第3页浏览型号AUIRF7103Q的Datasheet PDF文件第4页浏览型号AUIRF7103Q的Datasheet PDF文件第5页浏览型号AUIRF7103Q的Datasheet PDF文件第6页浏览型号AUIRF7103Q的Datasheet PDF文件第7页 
AUTOMOTIVE GRADE  
AUIRF7103Q  
HEXFET® Power MOSFET  
Features  
l AdvancedPlanarTechnology  
l Dual N Channel MOSFET  
l LowOn-Resistance  
l Dynamic dV/dT Rating  
l 175°COperatingTemperature  
l Fast Switching  
1
2
3
4
8
7
S1  
G1  
S2  
D1  
D1  
D2  
D2  
V(BR)DSS  
DS(on) max.  
ID  
50V  
130m  
3.0A  
6
5
R
G2  
l Lead-Free,RoHSCompliant  
l AutomotiveQualified*  
Top View  
Description  
Specifically designed for Automotive applications,  
this cellular design of HEXFET® Power MOSFETs  
utilizes the latest processing techniques to achieve  
low on-resistance per silicon area. This benefit com-  
bined with the fast switching speed and ruggedized  
device design that HEXFET power MOSFETs are  
well known for, provides the designer with an ex-  
tremely efficient and reliable device for use in Auto-  
motive and a wide variety of other applications.  
SO-8  
AUIRF7103Q  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated  
in the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect  
device reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air  
conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 4.5V  
Max.  
3.0  
Units  
A
I
I
I
@ TA = 25°C  
@ TA = 70°C  
D
D
Continuous Drain Current, VGS @ 4.5V  
Pulsed Drain Current  
2.5  
25  
DM  
Power Dissipation  
P
@TA = 25°C  
2.4  
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
16  
± 20  
W/°C  
V
VGS  
EAS  
IAR  
Single Pulse Avalanche Energy (Thermally Limited)  
22  
mJ  
A
Avalanche Current  
See Fig. 16c, 16d, 19, 20  
Repetitive Avalanche Energy  
EAR  
mJ  
dv/dt  
Peak Diode Recovery dv/dt  
Operating Junction and  
12  
V/ns  
°C  
T
-55 to + 175  
J
T
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Junction-to-Drain Lead  
Junction-to-Ambient  
Typ.  
–––  
Max.  
20  
Units  
°C/W  
RJL  
RJA  
–––  
62.5  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
December 5, 2012  

AUIRF7103Q 替代型号

型号 品牌 替代类型 描述 数据表
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