PD - 96366B
AUTOMOTIVE MOSFET
AUIRF7379Q
HEXFET® Power MOSFET
Features
l
l
l
l
l
l
l
l
AdvancedPlanarTechnology
LowOn-Resistance
Dual N and P Channel MOSFET
SurfaceMount
Available in Tape & Reel
150°COperatingTemperature
Automotive [Q101] Qualified
Lead-Free,RoHSCompliant
N-Ch
30V
P-Ch
-30V
N-CHANNEL MOSFET
1
2
3
4
8
D1
D1
S1
G1
V(BR)DSS
7
6
5
RDS(on) typ.
S2
D2
D2
0.038 0.070
Ω
Ω
G2
max.
0.045Ω 0.090Ω
5.8A -4.3A
P-CHANNEL MOSFET
Top View
Description
ID
Specifically designed for Automotive applications, these
HEXFET® Power MOSFET's in a Dual SO-8 package utilize
the lastest processing techniques to achieve extremely low
on-resistance per silicon area. Additional features of these
AutomotivequalifiedHEXFETPowerMOSFET's area150°C
junction operating temperature, fast switching speed and
improvedrepetitiveavalancherating.Thesebenefitscombine
to make this design an extremely efficient and reliable device
for use in Automotive applications and a wide variety of other
applications.
SO-8
The efficient SO-8 package provides enhanced thermal
characteristicsanddualMOSFETdiecapabilitymakingitideal
in a variety of power applications. This dual, surface mount
SO-8candramaticallyreduceboardspaceandisalsoavailable
in Tape & Reel.
G
Gate
D
Drain
S
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the
specifications is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (TA) is 25°C, unless otherwise specified.
Max.
Units
Parameter
N-Channel
P-Channel
Drain-Source Voltage
30
5.8
4.6
46
-30
-4.3
-3.4
-34
V
A
V
DS
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
I
I
I
@ TA = 25°C
D
D
@ TA = 70°C
DM
2.5
Power Dissipation
P
@TA = 25°C
D
W
0.02
± 20
Linear Derating Factor
Gate-to-Source Voltage
V
V
GS
dv/dt
5.0
-5.0
V/ns
Peak Diode Recovery dv/dt
Operating Junction and
T
T
J
-55 to + 150
°C
Storage Temperature Range
STG
Thermal Resistance
Parameter
Typ.
Max.
Units
RθJA
Junction-to-Ambient
–––
50
°C/W
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
08/24/11