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AUIRF7640S2TR PDF预览

AUIRF7640S2TR

更新时间： 2024-11-20 06:38:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲
页数 文件大小 规格书
11页 304K
描述
DirectFET Power MOSFET

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中文翻译

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AUIRF7640S2TR 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：CHIP CARRIER, R-XBCC-N2Reach Compliance Code：compliant
ECCN代码：EAR99Factory Lead Time：16 weeks
风险等级：5.33雪崩能效等级（Eas）：57 mJ
外壳连接：DRAIN配置：SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压：60 V最大漏极电流 (Abs) (ID)：77 A
最大漏极电流 (ID)：5.8 A最大漏源导通电阻：0.036 Ω
FET 技术：METAL-OXIDE SEMICONDUCTORJESD-30 代码：R-XBCC-N2
JESD-609代码：e3湿度敏感等级：1
元件数量：1端子数量：2
工作模式：ENHANCEMENT MODE最高工作温度：175 °C
封装主体材料：UNSPECIFIED封装形状：RECTANGULAR
封装形式：CHIP CARRIER峰值回流温度（摄氏度）：NOT SPECIFIED
极性/信道类型：N-CHANNEL最大功率耗散 (Abs)：30 W
最大脉冲漏极电流 (IDM)：84 A认证状态：Not Qualified
子类别：FET General Purpose Power表面贴装：YES
端子面层：Matte Tin (Sn)端子形式：NO LEAD
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
晶体管应用：SWITCHING晶体管元件材料：SILICON
Base Number Matches：1

AUIRF7640S2TR 数据手册

 浏览型号AUIRF7640S2TR的Datasheet PDF文件第2页浏览型号AUIRF7640S2TR的Datasheet PDF文件第3页浏览型号AUIRF7640S2TR的Datasheet PDF文件第4页浏览型号AUIRF7640S2TR的Datasheet PDF文件第5页浏览型号AUIRF7640S2TR的Datasheet PDF文件第6页浏览型号AUIRF7640S2TR的Datasheet PDF文件第7页 
PD -97551  
AUIRF7640S2TR  
AUTOMOTIVE GRADE  
AUIRF7640S2TR1  
DirectFET™ Power MOSFET ‚  
• Advanced Process Technology  
• Optimized for Class D Audio Amplifier and High Speed  
V(BR)DSS  
60V  
27m  
36m  
3.5  
Switching Applications  
• Low Rds(on) for Improved Efficiency  
RDS(on) typ.  
max.  
RG (typical)  
Qg (typical)  
• Low Qg for Better THD and Improved Efficiency  
• Low Qrr for Better THD and Lower EMI  
• Low Parasitic Inductance for Reduced Ringing and Lower EMI  
• Delivers up to 100W per Channel into an 8Ω Load  
• Dual Sided Cooling  
7.3nC  
• 175°C Operating Temperature  
• Repetitive Avalanche Capability for Robustness and Reliability  
• Lead free, RoHS and Halogen free  
DirectFET™ ISOMETRIC  
SB  
Applicable DirectFET Outline and Substrate Outline   
SB  
SC  
M2  
M4  
L4  
L6  
L8  
Description  
The AUIRF7640S2TR/TR1 combines the latest Automotive HEXFET® Power MOSFET Silicon technology with the advanced DirectFET  
packaging platform to produce a best in class part for Automotive Class D audio amplifier applications. The DirectFET package is compat-  
ible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection  
soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET  
package allows dual sided cooling to maximize thermal transfer in automotive power systems.  
This HEXFET Power MOSFET optimizes gate charge, body diode reverse recovery and internal gate resistance to improve key Class D  
audio amplifier performance factors such as efficiency, THD and EMI. Moreover the DirectFET packaging platform offers low parasitic  
inductance and resistance when compared to conventional wire bonded SOIC packages which improves EMI performance by reducing the  
voltage ringing that accompanies current transients.  
These features combine to make this MOSFET a highly desirable component in Automotive Class D audio amplifier and other high speed  
switching systems.  
Absolute Maximum Ratings  
Max.  
60  
Parameter  
Units  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
V
V
DS  
GS  
V
± 20  
21  
(Silicon Limited)  
(Silicon Limited)  
(Silicon Limited)  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
I
I
I
@ TC = 25°C  
D
D
D
15  
A
@ TC = 100°C  
@ TA = 25°C  
5.8  
77  
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
84  
I
DM  
30  
Power Dissipation  
P
P
@TC = 25°C  
@TA = 25°C  
D
D
W
2.4  
38  
Power Dissipation  
EAS  
AS (tested)  
Single Pulse Avalanche Energy (Thermally Limited)  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
mJ  
57  
E
IAR  
A
See Fig.18a, 18b, 15, 16  
EAR  
Repetitive Avalanche Energy  
Peak Soldering Temperature  
Operating Junction and  
mJ  
270  
T
T
T
P
-55 to + 175  
°C  
J
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Typ.  
–––  
12.5  
20  
Max.  
63  
Units  
°C/W  
W/°C  
RθJA  
Junction-to-Ambient  
RθJA  
Junction-to-Ambient  
Junction-to-Ambient  
Junction-to-Can  
–––  
–––  
5.0  
RθJA  
RθJ-Can  
RθJ-PCB  
–––  
1.4  
Junction-to-PCB Mounted  
–––  
0.2  
Linear Derating Factor  
HEXFET® is a registered trademark of International Rectifier.  
www.irf.com  
1
8/16/10  
1234567...11

中文翻译

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