PD - 97642
AUTOMOTIVE GRADE
AUIRF7416Q
Features
HEXFET® Power MOSFET
l
l
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Advanced Process Technology
LowOn-Resistance
A
P-ChannelMOSFET
Dynamic dV/dT Rating
150°C Operating Temperature
Fast Switching
1
2
3
4
8
7
D
D
D
D
S
S
S
V(BR)DSS
-30V
0.02
l
6
5
RDS(on) max.
ID
Ω
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G
Fully Avalanche Rated
Lead-Free, RoHS Compliant
Automotive Qualified*
-10A
Top View
Description
Specifically designed for Automotive applications, this cel-
lular design of HEXFET® Power MOSFETs utilizes the lat-
est processing techniques to achieve low on-resistance per
silicon area. This benefit combined with the fast switching
speed and ruggedized device design that HEXFET power
MOSFETs are well known for, provides the designer with an
extremely efficient and reliable device for use in Automo-
tive and a wide variety of other applications.
SO-8
AUIRF7416Q
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifica-
tions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The
thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature
(TA) is 25°C, unless otherwise specified.
Parameter
Continuous Drain Current, VGS @ -10V
Max.
-10
Units
I
I
I
@ TA = 25°C
@ TA = 70°C
D
D
Continuous Drain Current, VGS @ -10V
A
-7.1
-45
Pulsed Drain Current
DM
W
mW/°C
V
P
@TA = 25°C
Power Dissipation
2.5
D
Linear Derating Factor
Gate-to-Source Voltage
0.02
± 20
V
GS
EAS
Single Pulse Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
370
-5.0
mJ
dv/dt
V/ns
T
T
J
-55 to + 150
°C
Storage Temperature Range
STG
Thermal Resistance
Parameter
Max.
Units
RθJA
Junction-to-Ambient
50
°C/W
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
www.irf.com
1
02/28/2011