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STB4NB50 PDF预览

STB4NB50

更新时间: 2024-09-12 22:16:27
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
6页 66K
描述
N - CHANNEL 500V - 2.5ohm - 3.8A - D2PAK/I2PAK PowerMESHO MOSFET

STB4NB50 数据手册

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STB4NB50  
®
N - CHANNEL 500V - 2.5- 3.8A - D2PAK/I2PAK  
PowerMESH MOSFET  
PRELIMINARY DATA  
TYPE  
VDSS  
RDS(on)  
ID  
STB4NB50  
500 V  
< 2.8 Ω  
3.8 A  
TYPICAL RDS(on) = 2.5 Ω  
EXTREMELY HIGH dv/dt CAPABILITY  
100% AVALANCHE TESTED  
VERY LOW INTRINSIC CAPACITANCES  
GATE CHARGE MINIMIZED  
3
1
3
2
1
DESCRIPTION  
I2PAK  
TO-262  
(suffix "-1")  
D2PAK  
TO-263  
Using the latest high voltage MESH OVERLAY  
process, STMicroelectronics has designed an  
advanced family of power MOSFETs with  
outstanding performances. The new patent  
pending strip layout coupled with the Company’s  
proprietary edge termination structure, gives the  
lowest RDS(on) per area, exceptional avalanche  
and dv/dt capabilities and unrivalled gate charge  
and switching characteristics.  
(Suffix "T4")  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
HIGH CURRENT, HIGH SPEED SWITCHING  
SWITCH MODE POWER SUPPLIES (SMPS)  
DC-AC CONVERTERS FOR WELDING  
EQUIPMENT AND UNINTERRUPTIBLE  
POWER SUPPLIES AND MOTOR DRIVE  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
VDS  
VDGR  
VGS  
ID  
Parameter  
Value  
500  
Unit  
Drain-source Voltage (VGS = 0)  
V
V
500  
Drain- gate Voltage (RGS = 20 k)  
Gate-source Voltage  
± 30  
3.8  
V
o
Drain Current (continuous) at Tc = 25 C  
A
o
ID  
Drain Current (continuous) at Tc = 100 C  
2.4  
A
I
DM()  
Drain Current (pulsed)  
Total Dissipation at Tc = 25 oC  
Derating Factor  
15.2  
80  
A
Ptot  
W
0.64  
4.5  
W/oC  
V/ns  
oC  
oC  
dv/dt(1) Peak Diode Recovery voltage slope  
Tstg  
Tj  
Storage Temperature  
-65 to 150  
Max. Operating Junction Temperature  
150  
() Pulse width limited by safe operating area  
(1) ISD 4 A, di/dt 200 A/µs, VDD V(BR)DSS, Tj TJMAX  
1/8  
October 1998  

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