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NTTFS005N04CTAG

更新时间: 2024-09-14 11:15:51
品牌 Logo 应用领域
安森美 - ONSEMI 脉冲光电二极管晶体管
页数 文件大小 规格书
7页 214K
描述
Power MOSFET, Single N-Channel, 40 V, 5.6 mOhms, 69 A

NTTFS005N04CTAG 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, S-PDSO-F5Reach Compliance Code:not_compliant
Factory Lead Time:5 weeks风险等级:1.57
雪崩能效等级(Eas):103 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:40 V
最大漏极电流 (Abs) (ID):17 A最大漏极电流 (ID):17 A
最大漏源导通电阻:0.0056 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):22 pFJESD-30 代码:S-PDSO-F5
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):50 W最大脉冲漏极电流 (IDM):297 A
表面贴装:YES端子面层:Tin (Sn)
端子形式:FLAT端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管元件材料:SILICON
Base Number Matches:1

NTTFS005N04CTAG 数据手册

 浏览型号NTTFS005N04CTAG的Datasheet PDF文件第2页浏览型号NTTFS005N04CTAG的Datasheet PDF文件第3页浏览型号NTTFS005N04CTAG的Datasheet PDF文件第4页浏览型号NTTFS005N04CTAG的Datasheet PDF文件第5页浏览型号NTTFS005N04CTAG的Datasheet PDF文件第6页浏览型号NTTFS005N04CTAG的Datasheet PDF文件第7页 
NTTFS005N04C  
Power MOSFET  
40 V, 5.6 mW, 69 A, Single NChannel  
Features  
Small Footprint (3.3 x 3.3 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Capacitance to Minimize Driver Losses  
DS(on)  
www.onsemi.com  
These Devices are PbFree and are RoHS Compliant  
V
R
MAX  
I MAX  
D
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
(BR)DSS  
DS(on)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
40 V  
5.6 mW @ 10 V  
69 A  
V
DSS  
GatetoSource Voltage  
V
20  
V
GS  
NChannel  
D (5 8)  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
69  
A
C
D
q
JC  
T
C
39  
(Notes 1, 2, 3, 4)  
Steady  
State  
Power Dissipation  
T
C
P
50  
W
A
D
R
(Notes 1, 2, 3)  
q
JC  
T
C
= 100°C  
16  
G (4)  
Continuous Drain  
Current R  
T = 25°C  
A
I
17  
D
q
JA  
T = 100°C  
A
12  
S (1, 2, 3)  
(Notes 1, 3, 4)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.1  
1.6  
297  
W
D
R
(Notes 1, 3)  
q
JA  
MARKING DIAGRAM  
T = 100°C  
A
1
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
1
A
p
S
S
S
G
D
D
D
D
05NC  
AYWWG  
G
WDFN8  
(m8FL)  
Operating Junction and Storage Temperature  
Range  
T , T  
J
55 to  
+175  
°C  
stg  
CASE 511AB  
Source Current (Body Diode)  
I
42  
A
S
Single Pulse DraintoSource Avalanche  
E
103  
mJ  
AS  
05NC = Specific Device Code  
Energy (I  
= 4.6 A)  
L(pk)  
A
Y
= Assembly Location  
= Year  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
WW  
G
= Work Week  
= PbFree Package  
(Note: Microdot may be in either location)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Parameter  
Symbol  
Value  
3.0  
Unit  
JunctiontoCase Steady State (Note 3)  
JunctiontoAmbient Steady State (Note 3)  
R
°C/W  
q
JC  
R
47.7  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD5112 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
2
3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Continuous DC current rating. Maximum current for pulses as long as 1  
second is higher but is dependent on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
January, 2019 Rev. 0  
NTTFS005N04C/D  
 

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