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NTTFS3A08PTAG PDF预览

NTTFS3A08PTAG

更新时间: 2024-11-02 01:16:55
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
3页 99K
描述
Power MOSFET .20 V, .14 A, Single P.Channel, 8FL

NTTFS3A08PTAG 数据手册

 浏览型号NTTFS3A08PTAG的Datasheet PDF文件第2页浏览型号NTTFS3A08PTAG的Datasheet PDF文件第3页 
NTTFS3A08P  
Product Preview  
Power MOSFET  
20 V, 14 A, Single PChannel, m8FL  
Features  
Ultra Low R  
to Minimize Conduction Losses  
m8FL 3.3 x 3.3 x 0.8 mm for Space Saving and Excellent Thermal  
DS(on)  
http://onsemi.com  
Conduction  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
ESD Protection Level of 5 kV per JESD22A114  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
6.7 mW @ 4.5 V  
9.0 mW @ 2.5 V  
20 V  
14 A  
Applications  
PChannel MOSFET  
Battery/Switch  
High Side Load Switch  
Optimized for Power Management Applications for Portable  
Products such as Media Tablets, Ultrabook PCs and Cellphones  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
G
Parameter  
DraintoSource Voltage  
Symbol Value Unit  
V
DSS  
20  
8
V
V
A
D
GatetoSource Voltage  
V
GS  
MARKING DIAGRAM  
Continuous Drain  
T = 25°C  
I
D
14  
10  
2.2  
A
Current R  
(Note 1)  
1
q
JA  
T = 85°C  
A
1
S
S
S
G
D
D
D
D
XXXX  
AYWWG  
G
WDFN8  
(m8FL)  
CASE 511AB  
Power Dissipation R  
(Note 1)  
T = 25°C  
A
P
D
W
A
q
JA  
Continuous Drain  
T = 25°C  
I
20  
15  
4.5  
A
D
Current R  
(Note 1)  
10 s  
q
JA  
T = 85°C  
A
Steady  
State  
XXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
= Work Week  
Power Dissipation  
10 s (Note 1)  
T = 25°C  
A
P
I
W
A
D
R
q
JA  
WW  
G
Continuous Drain  
Current R (Note 2)  
T = 25°C  
A
9  
6  
= PbFree Package  
D
q
JA  
T = 85°C  
A
(Note: Microdot may be in either location)  
Power Dissipation  
(Note 2)  
T = 25°C  
P
0.84  
W
A
D
R
q
JA  
ORDERING INFORMATION  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
43  
A
A
p
Device  
Package  
Shipping  
Operating Junction and Storage Temperature  
T ,  
55 to  
+150  
°C  
J
stg  
NTTFS3A08PTAG  
WDFN8  
(PbFree)  
1500 / Tape &  
Reel  
T
ESD (HBM, JESD22A114)  
V
ESD  
5000  
6  
V
A
NTTFS3A08PTWG WDFN8  
1500 / Tape &  
Reel  
Source Current (Body Diode)  
I
S
(PbFree)  
Lead Temperature for Soldering Purposes  
T
260  
°C  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
L
(1/8from case for 10 s)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.  
2. Surfacemounted on FR4 board using the minimum recommended pad size.  
This document contains information on a product under development. ON Semiconductor  
reserves the right to change or discontinue this product without notice.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
June, 2012 Rev. P0  
NTTFS3A08P/D  
 

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