NTTFS3A08P
Product Preview
Power MOSFET
−20 V, −14 A, Single P−Channel, m8FL
Features
• Ultra Low R
to Minimize Conduction Losses
• m8FL 3.3 x 3.3 x 0.8 mm for Space Saving and Excellent Thermal
DS(on)
http://onsemi.com
Conduction
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
• ESD Protection Level of 5 kV per JESD22−A114
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
6.7 mW @ −4.5 V
9.0 mW @ −2.5 V
−20 V
−14 A
Applications
P−Channel MOSFET
• Battery/Switch
• High Side Load Switch
• Optimized for Power Management Applications for Portable
Products such as Media Tablets, Ultrabook PCs and Cellphones
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
G
Parameter
Drain−to−Source Voltage
Symbol Value Unit
V
DSS
20
8
V
V
A
D
Gate−to−Source Voltage
V
GS
MARKING DIAGRAM
Continuous Drain
T = 25°C
I
D
−14
−10
2.2
A
Current R
(Note 1)
1
q
JA
T = 85°C
A
1
S
S
S
G
D
D
D
D
XXXX
AYWWG
G
WDFN8
(m8FL)
CASE 511AB
Power Dissipation R
(Note 1)
T = 25°C
A
P
D
W
A
q
JA
Continuous Drain
T = 25°C
I
−20
−15
4.5
A
D
Current R
(Note 1)
≤ 10 s
q
JA
T = 85°C
A
Steady
State
XXXX = Specific Device Code
A
Y
= Assembly Location
= Year
= Work Week
Power Dissipation
≤ 10 s (Note 1)
T = 25°C
A
P
I
W
A
D
R
q
JA
WW
G
Continuous Drain
Current R (Note 2)
T = 25°C
A
−9
−6
= Pb−Free Package
D
q
JA
T = 85°C
A
(Note: Microdot may be in either location)
Power Dissipation
(Note 2)
T = 25°C
P
0.84
W
A
D
R
q
JA
ORDERING INFORMATION
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
−43
A
A
p
†
Device
Package
Shipping
Operating Junction and Storage Temperature
T ,
−55 to
+150
°C
J
stg
NTTFS3A08PTAG
WDFN8
(Pb−Free)
1500 / Tape &
Reel
T
ESD (HBM, JESD22−A114)
V
ESD
5000
−6
V
A
NTTFS3A08PTWG WDFN8
1500 / Tape &
Reel
Source Current (Body Diode)
I
S
(Pb−Free)
Lead Temperature for Soldering Purposes
T
260
°C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
L
(1/8″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
June, 2012 − Rev. P0
NTTFS3A08P/D