MOSFET - Single N-Channel
40 V, 2.1 mW, 150 A
NTTFS2D1N04HL
Features
• Max R
• Max R
= 2.1 mW at V = 10 V, I = 23 A
GS D
DS(on)
= 3.3 mW at V = 4.5 V, I = 18 A
DS(on)
GS
D
• High Performance Technology for Extremely Low R
DS(on)
www.onsemi.com
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
Typical Applications
• DC−DC Buck Converters
• Point of Load
• High Efficiency Load Switch and Low Side Switching
• Oring FET
2.1 mW @ 10 V
3.3 mW @ 4.5 V
40 V
150 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
V
DSS
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
T
= 25°C
I
150
A
C
D
N−CHANNEL MOSFET
Current R
(Note 1)
q
JC
Steady
State
Power Dissipation
(Note 1)
P
83
24
W
A
D
R
q
JC
Continuous Drain
Current R
T = 25°C
A
I
D
q
JA
Steady
State
(Notes 1, 2)
Power Dissipation
P
2.2
W
D
R
(Notes 1, 2)
q
JA
WDFN8
3.3X3.3, 0.65P
CASE 483AW
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
958
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+150
°C
J
stg
Source Current (Body Diode)
I
S
69
A
MARKING DIAGRAM
Single Pulse Drain−to−Source Avalanche
E
AS
126
mJ
Energy (I = 29 A, L = 0.3 mH) (Note 3)
AV
S2D1
AYWWZZ
Lead Temperature Soldering Reflow for Sol-
dering Purposes (1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
S2D1 = Specific Device Code
A
Y
= Assembly Plant Code
= Numeric Year Code
THERMAL RESISTANCE RATINGS
WW = Work Week Code
ZZ = Assembly Lot Code
Parameter
Symbol
Value
1.5
Unit
Junction−to−Case − Steady State (Note 1)
Junction−to−Ambient − Steady State (Note 1)
R
°C/W
q
JC
ORDERING INFORMATION
R
54.8
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
Device
NTTFS2D1N04HLTWG
Package
Shipping†
2
PQFN8
(Pb−Free) Tape & Reel
3000 /
2. Surface−mounted on FR4 board using 1 in pad size, 1 oz. Cu pad.
3. E of 126 mJ is based on started T = 25°C, I = 29 A, V = 32 V, V =
AS
J
AS
DD
GS
10 V. 100% test at I = 29 A.
AS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
May, 2020 − Rev. 1
NTTFS2D1N04HL/D