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NTTFS2D1N04HLTWG PDF预览

NTTFS2D1N04HLTWG

更新时间: 2024-11-02 11:15:55
品牌 Logo 应用领域
安森美 - ONSEMI
页数 文件大小 规格书
7页 503K
描述
N-Channel Shielded Gate PowerTrench® MOSFET 40 V, 150 A, 2.1 mΩ

NTTFS2D1N04HLTWG 数据手册

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MOSFET - Single N-Channel  
40 V, 2.1 mW, 150 A  
NTTFS2D1N04HL  
Features  
Max R  
Max R  
= 2.1 mW at V = 10 V, I = 23 A  
GS D  
DS(on)  
= 3.3 mW at V = 4.5 V, I = 18 A  
DS(on)  
GS  
D
High Performance Technology for Extremely Low R  
DS(on)  
www.onsemi.com  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
Typical Applications  
DCDC Buck Converters  
Point of Load  
High Efficiency Load Switch and Low Side Switching  
Oring FET  
2.1 mW @ 10 V  
3.3 mW @ 4.5 V  
40 V  
150 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
T
= 25°C  
I
150  
A
C
D
NCHANNEL MOSFET  
Current R  
(Note 1)  
q
JC  
Steady  
State  
Power Dissipation  
(Note 1)  
P
83  
24  
W
A
D
R
q
JC  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
q
JA  
Steady  
State  
(Notes 1, 2)  
Power Dissipation  
P
2.2  
W
D
R
(Notes 1, 2)  
q
JA  
WDFN8  
3.3X3.3, 0.65P  
CASE 483AW  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
958  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+150  
°C  
J
stg  
Source Current (Body Diode)  
I
S
69  
A
MARKING DIAGRAM  
Single Pulse DraintoSource Avalanche  
E
AS  
126  
mJ  
Energy (I = 29 A, L = 0.3 mH) (Note 3)  
AV  
S2D1  
AYWWZZ  
Lead Temperature Soldering Reflow for Sol-  
dering Purposes (1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
S2D1 = Specific Device Code  
A
Y
= Assembly Plant Code  
= Numeric Year Code  
THERMAL RESISTANCE RATINGS  
WW = Work Week Code  
ZZ = Assembly Lot Code  
Parameter  
Symbol  
Value  
1.5  
Unit  
JunctiontoCase Steady State (Note 1)  
JunctiontoAmbient Steady State (Note 1)  
R
°C/W  
q
JC  
ORDERING INFORMATION  
R
54.8  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
Device  
NTTFS2D1N04HLTWG  
Package  
Shipping†  
2
PQFN8  
(PbFree) Tape & Reel  
3000 /  
2. Surfacemounted on FR4 board using 1 in pad size, 1 oz. Cu pad.  
3. E of 126 mJ is based on started T = 25°C, I = 29 A, V = 32 V, V =  
AS  
J
AS  
DD  
GS  
10 V. 100% test at I = 29 A.  
AS  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
May, 2020 Rev. 1  
NTTFS2D1N04HL/D  
 

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