NTTFS015P03P8Z
MOSFET – Power, Single,
P-Channel, m8FL
-30 V, 7.5 mW
Features
• Ultra Low R
www.onsemi.com
to Improve System Efficiency
DS(on)
• Advanced Package Technology in 3.3x3.3mm for Space Saving and
Excellent Thermal Conduction
V
R
I
D
(BR)DSS
DS(on)
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
7.5 mW @ −10 V
12 mW @ −4.5 V
−30 V
−47.6 A
Typical Applications
• Power Load Switch
S (1, 2, 3)
• Protection: Reverse Current, Over Voltage, and Reverse Negative
Voltage
• Battery Management
G (4)
P−Channel
MOSFET
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
−30
Unit
V
D (5, 6, 7, 8)
V
DSS
Gate−to−Source Voltage
V
"25
−47.6
−34.4
33.8
V
GS
MARKING
DIAGRAM
Continuous Drain Cur-
T
T
T
= 25°C
= 85°C
= 25°C
I
A
C
C
C
D
rent R
(Notes 1, 2)
q
JC
1
Steady
State
1
S
S
S
G
D
D
D
D
Power Dissipation R
(Notes 1, 2)
P
W
A
q
D
JC
15P3
AYWWG
G
WDFN8
(m8FL)
CASE 511AB
Continuous Drain Cur-
rent R (Notes 1, 2)
T = 25°C
A
I
−13.4
−9.6
2.66
D
q
JA
T = 85°C
A
Steady
State
15P3
A
Y
= Specific Device Code
= Assembly Location
= Year
Power Dissipation R
(Notes 1, 2)
T = 25°C
A
P
W
q
D
JA
WW
G
= Work Week
= Pb−Free Package
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
−195
A
A
p
Operating Junction and Storage Temperature
T , T
−55 to
150
°C
J
stg
(Note: Microdot may be in either location)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
ORDERING INFORMATION
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
†
Device
Package
Shipping
NTTFS015P03P8ZTAG
WDFN8 1500 / Tape &
THERMAL RESISTANCE MAXIMUM RATINGS
(Pb−Free) Reel
Parameter
Symbol
Value
Unit
NTTFS015P03P8ZTWG WDFN8 3000 / Tape &
(Pb−Free) Reel
Junction−to−Case − Steady State (Drain)
R
3.7
°C/W
q
JC
(Note 2)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Junction−to−Ambient − Steady State (Note 2)
R
47
°C/W
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 1 in , 2 oz. Cu pad. Assuming a
76mm x 76mm x 1.6mm board.
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
June, 2019 − Rev. 0
NTTFS015P03P8Z/D