DATA SHEET
www.onsemi.com
MOSFET – P-Channel,
POWERTRENCH)
V
R
MAX
I MAX
D
DS
DS(on)
−20 V
6.5 mW @ −4.5 V
9.8 mW @ −2.5 V
20 mW @ −1.8 V
−56 A
-20 V, -56 A, 6.5 mW
NTTFS007P02P8
Pin 1
Pin 1
S
S
General Description
S
G
This P−Channel MOSFET is produced using onsemi’s advanced
POWERTRENCH process that has been optimized for R
switching performance and ruggedness.
,
DS(on)
D
D
D
D
Top
Features
Bottom
Max R
Max R
Max R
= 6.5 mW at V = −4.5 V, I = −14 A
GS D
DS(on)
DS(on)
DS(on)
PQFN8 3.3X3.3, 0.65P
(Power 33)
= 9.8 mW at V = −2.5 V, I = −11 A
GS
D
CASE 483AX
= 20 mW at V = −1.8 V, I = −9 A
GS
D
High Performance Trench Technology for Extremely Low R
High Power and Current Handling Capability in a Widely Used
Surface Mount Package
DS(on)
PIN ASSIGNMENT
S
8
D
This Device is Pb−Free, Halide Free and is RoHS Compliant
1
Applications
Load Switch
Battery Management
Power Management
Reverse Polarity Protection
S
S
2
7
6
5
D
D
D
3
4
G
MOSFET MAXIMUM RATINGS (T = 25C unless otherwise noted)
A
MARKING DIAGRAM
Symbol
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Ratings
−20
Unit
V
V
DS
GS
V
8
V
&Z&3&K
FDMC
6688P
I
D
A
−Continuous, T = 25C
−56
−14
−226
C
−Continuous, T = 25C (Note 1a)
A
−Pulsed (Note 3)
P
D
Power Dissipation
W
T
= 25C
30
2.3
C
&Z
&3
&K
= Assembly Plant Code
= 3−Digit Date−Code (YWW)
= 2−Digit Lot Traceability Code
T = 25C (Note 1a)
A
T , T
Operating and Storage Junction
Temperature Range
−55 to +150
C
J
STG
FDMC6688P = Specific Device Code
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
†
Device
Package
Shipping
THERMAL CHARACTERISTICS (T = 25C unless otherwise noted)
A
NTTFS007P02P8
PQFN8
(Power 33)
(Pb−Free)
3,000 /
Tape & Reel
Symbol
Parameter
Value
3.8
Unit
C/W
C/W
R
Thermal Resistance, Junction to Case
q
JC
R
Thermal Resistance,
Junction to Ambient (Note 1a)
53
q
JA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Semiconductor Components Industries, LLC, 2023
1
Publication Order Number:
April, 2023 − Rev. 0
NTTFS007P02P8/D