MOSFET - Single N-Channel
60 V, 3.9 mW, 103 A
NTTFS3D7N06HL
Features
• Max R
• Max R
= 3.9 mW at V = 10 V, I = 23 A
GS D
DS(on)
= 5.2 mW at V = 4.5 V, I = 18 A
DS(on)
GS
D
www.onsemi.com
• High Performance Technology for Extremely Low R
DS(on)
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
Typical Applications
3.9 mW @ 10 V
5.2 mW @ 4.5 V
60 V
103 A
• DC−DC Buck Converters
• Point of Load
• High Efficiency Load Switch and Low Side Switching
• Oring FET
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
V
DSS
N−CHANNEL MOSFET
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
T
= 25°C
I
103
A
C
D
Current R
(Note 1)
q
JC
Steady
State
Power Dissipation
(Note 1)
P
83
16
W
A
D
R
q
JC
Continuous Drain
Current R
T = 25°C
A
I
D
q
JA
Steady
State
(Notes 1, 2)
Power Dissipation
P
2.2
W
WDFN8
D
R
(Notes 1, 2)
q
JA
3.3X3.3, 0.65P
CASE 483AW
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
658
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+150
°C
J
stg
MARKING DIAGRAM
Source Current (Body Diode)
I
69
80
A
S
S3D7
AYWWZZ
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (I = 40 A, L = 0.1 mH) (Note 3)
AV
Lead Temperature Soldering Reflow for Sol-
dering Purposes (1/8″ from case for 10 s)
T
L
260
°C
S3D7 = Specific Device Code
A
Y
= Assembly Plant Code
= Numeric Year Code
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
WW = Work Week Code
ZZ = Assembly Lot Code
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Value
1.5
Unit
ORDERING INFORMATION
Junction−to−Case − Steady State (Note 1)
Junction−to−Ambient − Steady State (Note 1)
R
°C/W
q
JC
Device
NTTFS3D7N06HLTWG
Package
Shipping†
R
54.8
q
JA
WDFN8
3000 /
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
(Pb−Free) Tape & Reel
2
2. Surface−mounted on FR4 board using 1 in pad size, 1 oz. Cu pad.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
3. E of 80 mJ is based on started T = 25°C, I = 40 A, V = 60 V, V =
AS
J
AS
DD
GS
10 V. 100% test at I = 40 A.
AS
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
October, 2020 − Rev. 2
NTTFS3D7N06HL/D